L6474过热

我使用三个L6474来驱动NEMA23格式电机。


使用默认寄存器配置，芯片迅速变得非常热并导致TH_WRN条件。

我在这里发现一篇文章说明默认配置导致高频切换产生“强”散热。它还推荐了一些替代配置，其主要变化是将TON_MIN从20.4μs减少到4μs。还有人认为某些配置会导致控制算法不稳定。

我做到了这一点，并降低了转换速率，现在筹码达到了更加合理的约60度。 C。

虽然这确实提供了一个测试我的ISR处理FLAG输入变化的便利机会，但是芯片没有提供更好的默认配置似乎很奇怪。

什么样的电机负载是默认配置适合？

现在有大约六个可配置的内部算法参数，这个半任意的值集似乎比工程解决方案更糟糕。

是否有关于如何调整这些参数以减少耗散并避免可能的不稳定配置的指导？

谢谢。



以下为原文




I am using three L6474s to drive NEMA23 format motors.


Using the default register configurations the chips are rapidly getting very hot and causing a TH_WRN condition.  

I found a post here that stated that the default config caused high frequency switching which produced ''strong'' heat dissipation. It also recommended some alternative configuration, the main change of which was reducing TON_MIN from 20.4 µs to 4µs .  There was also suggest that some configurations lead to the control algorithm being unstable.

I did that and reduced slew-rate and now the chips are getting to a much more reasonable circa 60 deg. C.  

while this did provide a convenient opportunity to test my ISR handling FLAG input change, it seems odd that the chip is not supplied with a better default configuration.  

What kind of motor loading is the default config suitable for?  

Now with about six configurable parameters for internal algorithm, this semi-arbitrary set of values seems more of a hack than an engineered solution.  

Is there any guidance on how to tune these parameters to reduce dissipation and avoid possibly unstable configurations?

Thanks.