如何使用校准寄存器？

我们正在评估LPS25HB BP传感器，并有几个问题。我注意到有几个论坛成员提出了类似的问题，但未收到回复。我真的很感激答案，因为这表明LPS25HB不是一种“孤儿”，不受支持的产品。
1）数据表提到了对BP的焊接效果，并说可以使用寄存器来存储单点校准。数据表中没有关于此的任何其他细节。我们发现我们测试的样品中存在大量（~0.5 kPa +）压力不准确度。这是预期的吗？究竟我们如何使用校准寄存器？它是如何计算的？同样，这些对任何用户都是重要的，数据表没有提供有意义的信息。
2）我们注意到对BP的温度影响很大。看来芯片内部没有进行温度补偿，尽管数据表提到了二次温度补偿，并声称20-60C的变化只会导致20 Pa（0.2 hPa）的变化。我看到，从~5℃的环境温度变化幅度或更大，实际环境BP没有显着变化。是否需要打开内部温度补偿？或者由用户决定经验温度校准？
我们将非常感谢这些问题的答案，并将帮助我们评估LPS25HB相对于其他制造商生产的竞争传感器。

＃lps25hb



以下为原文




We are evaluating the LPS25HB BP sensor, and have a couple of questions. I notice that several forum members have asked similar questions, but without receiving a reply. I would really appreciate an answer, as this would indicate that the LPS25HB is not an 'orphan', unsupported product.
1) The datasheet mentions a soldering effect on BP, and says that a register is available to store a one-point calibration. There are no other details at all about this in the datasheet. We have found substantial (~0.5 kPa+) pressure inaccuracy in samples we have tested. Is this to be expected? Exactly how are we to use the calibration register? How is it calculated? Again, these are important points for any user, and the datasheet gives no meaningful information.
2) We notice a very substantial temperature effect on BP. It appears that no temperature compensation is being done internally to the chip, although the datasheet mentions quadratic temperature compensation, and claims that a 20-60C change will cause only a 20 Pa (0.2 hPa) change. I see that magnitude of change or greater from a ~5C ambient temperature change with no significant change in actual ambient BP. Does internal temperature compensation need to be turned on? Or is it up to the user to determine an empirical temperature calibration?
Answers to these questions would be greatly appreciated and will help us to evaluate the LPS25HB relative to competitive sensors made by other manufacturers.

#lps25hb