Artix 7 XC7A200TSBG484-2包装运行温度超过预期

嗨，
设备未配置时显示的温度是多少？
请估算该设备的温度和当前要求，设计应该可以让您了解温度。
请根据您的设计要求交叉检查您是否提供了正确的电源（电流要求）。
谢谢，AnirudhPS：请将此标记作为答案，以防它有助于解决您的问题。如果帖子引导您找到解决方案，请给予赞誉。



以下为原文

Hi,
 
What temperature does the device show when it is not configured?
 
Please run an estimate of the termperature and the current requirements for this device, design which should give you an idea on the temperature.
 
Please cross check that you are giving the proper power supplies(current requiremment) based on your design requirement. 
Thanks,
Anirudh

PS: Please MARK this as an answer in case it helped resolve your query.Give kudos in case the post guided you to a solution.

HiAnirudh
感谢您的答复。
我们选择的电源是ADP5050，它以5V为输入，输出FPGA所需的1V，2.5V，3.3V和1.8V。
它设置为能够在1V上提供2.63A，在2.5V时提供2.63A，在3.3V时提供1.2A，在1.8V通道上提供1.2A。
这应该绰绰有余。
分析显示预测结温为31.5°C，总芯片功率为1.974W，有效热阻为3.3°C / W.
用于此分析的设计是将pwm驱动至7个电机并读取其各自编码器的测试项目。
最终的完整设计将包含更多逻辑。
在设备编程之前，我看到测得的温度已经是37°C。
这可能让我相信FPGA正在按预期运行，但是通过电路板上的其他组件通过接地层加热，由于电路板上没有空间，电源芯片非常靠近FPGA。
如果这是真的，解决这个问题的唯一方法是散热器，我在FPGA VHDL方面无法做任何事情来影响这一点吗？
再次感谢你。



以下为原文

Hi Anirudh
 
Thank you for the reply.
 
The supply we chose is the ADP5050 which takes 5V as input and outputs the required 1V, 2.5V, 3.3V and 1.8V required by the FPGA. It is set up to be able to supply 2.63A on the 1V, 2.63A on the 2.5V, 1.2A on the 3.3V and 1.2A on the 1.8V channels respectively. This should be more than enough.
 
The analysis shows a predicted junction temperature of 31.5 °C, total chip power of 1.974W and an effective thermal resistance of 3.3 °C/W.
The design used for this analysis is a test project to drive pwm to 7 motors and read their respective encoders. The eventual full design will contain allot more logic.
 
I see the measured temperature before programming the device is already 37 °C. This might lead me to believe that the FPGA is performing as expected, but is being heated through the ground planes by the other components on the board, the supply chip is sitting very close to the FPGA because of the lack of space on the board.
 
If this is true the only way to resolve this is a heatsink and there is nothing I can do on the FPGA VHDL side to impact this?
 
Thank you again.
 

似乎热量和更大的电流消耗与使用FPGA上的差分缓冲器有关。
当我为我们的设计实现所有LVDS缓冲器时，它在电源上拉近400mA。
我正在努力寻找一份文件，详细说明在FPGA上实例化IBUFDS和OBUFDS缓冲器的预期电流消耗。



以下为原文

It also seems that the heat and larger current consumption is related to using the differential buffers on the FPGA. when I implement all the LVDS buffers for our design it pulls close to 400mA on the supply. I am struggling to find a document detailing the expected current consumption from instantiating IBUFDS and OBUFDS buffers on the FPGA.