[问答]

LSM9DS1的土地格局？

问答对人有帮助，内容完整，我也想知道答案 0 在TN0018“采用LGA封装的MEMS传感器的表面安装指南”中，根据“LGA引脚间距”是（a）是否大于0.2 mm或（b）是否等于或者，它对焊盘尺寸提供了不同的指导。小于0.2毫米。如果（a），它表示垫片的长度和宽度都超过了0.1毫米;如果（b），垫片没有超大尺寸。 “LGA引脚间距”这个短语是指引脚间的开放空间还是引脚间距？我认为我没有看到0.2毫米间距的部分，更不用说那个了;我见过的最小的microBGA部件的间距超过0.2毫米。无论如何，LMS9DS1的间距为0.43 mm，但其引脚之间的开放空间恰好为0.2 mm。我们是否通过俯仰，并将垫片的长度和宽度都加大了0.1毫米？或者我们是通过引脚之间的空隙来进行的，而不是过大的焊盘？要么...？：在这个帖子中 - https://community.st.com/message/132775 - 米罗斯拉夫B指的是TN0018，并继续建议将垫片长度增加0.1毫米，但垫片宽度仅为0.05毫米。这与TN0018第5页的超大建议相矛盾。如果对问题1的答案为“是”，我们应该对LSM9DS1的焊盘进行加大尺寸，那么我们是否应该遵循TN0018的指导并在两个尺寸上将焊盘尺寸增大0.1 mm？或者我们是否应该遵循Miroslav B对LIS2HH12的建议，并且仅将垫片的长度超过0.1 mm，将它们的宽度超过0.05 mm？谢谢！＃lsm9ds1＃PCB-design＃pcb-guidelines＃pcb-layout 以上来自于谷歌翻译以下为原文 In TN0018 'Surface mounting guidelines for MEMS sensors in an LGA package', on Page 5 it offers different guidance on land pad dimensions depending on whether the 'LGA pin spacing' is (a) greater than 0.2 mm or (b) equal to or less than 0.2 mm. If (a), it says oversize the land pads by 0.1 mm in both length and width; if (b), the land pads are not oversized. Does the phrase 'LGA pin spacing' mean open space between pins or pin pitch? I don't think I've seen a part with 0.2 mm pitch, to say nothing of less than that; the smallest microBGA parts I've seen have a pitch more than 0.2 mm. Anyway, the LMS9DS1 has a pitch of 0.43 mm, but its open space between pins is exactly 0.2 mm. Do we go by pitch, and oversize the land pads by 0.1 mm in both length and width? Or do we go by open space between pins, and not oversize the land pads? Or...? : In this thread -- https://community.st.com/message/132775 -- Miroslav B refers to TN0018, and goes on to suggest oversizing the land-pad length by 0.1 mm but the land-pad width by only 0.05 mm. This contradicts the oversizing suggestion on Page 5 of TN0018. If the answer to QUESTION 1 is 'yes, we should oversize the land pads for the LSM9DS1', then should we follow TN0018 guidance and oversize the land pads by 0.1 mm in both dimensions? Or should we follow Miroslav B's recommendation for the LIS2HH12, and oversize only the length of the land pads by 0.1 mm, oversizing their width by only 0.05 mm?Thanks! #lsm9ds1 #pcb-design #pcb-guidelines #pcb-layout 0
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答案对人有帮助，有参考价值 0 LGA引脚间距意味着引脚之间的开放空间。关于过大的垫子并不是那么简单。我想要获得最好的质量和可重复性，你必须与之讨论 PCB制造商和装配厂。如果您计划批量生产，则应进行测试批次以验证您的制造过程的设计和可靠性。根据我的知识和经验，我只能给你我的建议。如果装配将由机器完成，不要过大的垫。如果你手工组装过大的长度垫片的厚度为0.1毫米宽度仅0.05毫米。以上来自于谷歌翻译以下为原文 LGA pin spacing means open space between pins. Concerning the oversizing the land-pad is not that simple. I you want to get the best possible quality and repeatability you have to discuss this with PCB manufacturer and assembly plant. If you plan a mass production you should make a test batch to validate your desing and reliability of manaufacturing process. I can give you only my recommendation based on my knowledge and experiences, If the assembly will be done by machine, do not oversize the pads. If you will do the assembly by hand oversize the length of the land pads by 0.1 mm and the width by only 0.05 mm.

2018-10-9 15:37:29 评论举报曾玲娟

答案对人有帮助，有参考价值 0 谢谢！事实上，我意识到与工厂和装配的良好沟通对于大规模生产的成功至关重要。对于这一系列的零件 - MEMS传感器 - ST Micro文档强调仔细的PCB和模板设计，以最大限度地减少测量误差和失真。这不是董事会或组装供应商有能力与之交谈的事情;他们只关心成功的装配，而不是一致的测量质量。所以我非常感谢你的指导！再次感谢。以上来自于谷歌翻译以下为原文 Thanks! Indeed I'm aware of good communication with fab and assembly being critical to success of mass production. For this family of parts -- MEMS sensors -- ST Micro documentation emphasizes careful PCB and stencil design to minimize measurement error and distortion. This is not something the board or assembly vendors will have any ability to speak to; they are only concerned with successful assembly, not consistent measurement quality. So I'm very grateful for your guidance! Thanks again.

2018-10-9 15:45:25 评论举报陈畅妮