具有两种材料的基材怎么定义电介质通路

动量只能模拟平面电介质，没有“电介质通孔”。
因此，对于此类工作，您将需要ADS FEM求解器引擎。
您需要首先使用一个“默认”电介质定义基板文件，然后将其他材料定义为“电介质通孔”，它可以替换默认电介质。
所以在你的情况下，使用air和er1和er2，你可以用空气定义叠加，然后将er1和er2建模为两个介质过孔。
如果er1和er2基板具有不同的厚度，则对介电通孔使用不同的高度。
现在，您需要两个图层来绘制er1和er2基板边界。
在我附带的示例中，我为此定义了两个新层：my_sub1和my_sub2。
在我的示例中，默认（背景）材质是空气。
如果这些基板的厚度不同，则需要在不同高度（不同的z位置）映射两个导体层。
希望这有道理吗？
two_sub_1.PNG4.7 KB



     以下为原文

  Momentum can only simulate planar dielectrics, with no "dielectric vias". So for this type of work, you will need the ADS FEM solver engine. 

You need to define your substrate file with one "default" dielectric first, and then you define other materials as "dielectric via" which can replace the default dielectric. So in your case, with air and er1 and er2, you could define a stackup with air, and then model er1 and er2 as two dielectric vias. If the er1 and er2 substrates have different thickness, use different height for the dielectric vias. 

Now, you need two layers where you draw the er1 and er2 substrate boundary. In my attached example, I have defined two new layers for that: my_sub1 and my_sub2. The default (background) material is air in my example. If the thickness of these substrates is different, you will need two conductor layers mapped at the different heights (different z-positions). 

Hope this makes sense?

附件

• two_sub_2.PNG6.7 KB
  
• two_sub_1.PNG4.7 KB
  

非常感谢Volker，我从你的描述和图片中了解到，你已经定义了两种高度为200和300微米的材料。
现在，如果我想要达到我应该做的同样的高度。
非常感谢，Mojtaba



     以下为原文

  Thanks a lot Volker,

What I understand from your description and pictures, you have defined two materials with height 200 and 300 um. Now if I want to have same heights what I should do. Thanks a lot,

Mojtaba

> {quote：title = Mojtaba77写道：} {quote}>我从你的描述和图片中了解到，你已经定义了两种高度为200和300微米的材料。
现在，如果我想要达到我应该做的同样的高度。
这更容易。
定义两个具有相同高度的介电通孔。
在这种情况下，您可以使用相同的金属层在两个基板上绘制导体，因为它们处于相同的高度（相同的z位置）。



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}

> What I understand from your description and pictures, you have defined two materials with height 200 and 300 um. Now if I want to have same heights what I should do. 

That is even easier. Define two dielectric vias with the same height. In this case, you can use the same metal layer for drawing the conductor on both substrates, because they are at the same height (same z position).

在那种情况下，它如何检测哪种基材属于哪种金属？
我的意思是基板之间没有边界！编辑：Mojtaba77于2014年7月23日上午9:10



     以下为原文

  In that case, how it detects what substrate belongs to what metal? I mean there is no border between substrate!

Edited by: Mojtaba77 on Jul 23, 2014 9:10 AM

> {quote：title = Mojtaba77写道：} {quote}>在这种情况下，它如何检测哪种底物属于哪种金属。
我的意思是基板之间没有边界？
如上所述，您需要在“电介质通孔”层上绘制两个基板矩形。
对于金属，可以在两个基板上使用相同的层，因为两种金属都处于相同的高度。



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}
> In that case, how it detects what substrate belongs to what metals. I mean there is no border between substrate?

As I wrote above, you need to draw the two substrate rectangles on the "dielectric via" layers. For the metals, you can use the same layer on both substrates, because both metals are at the same height.

对不起Volker因为这个可能非常明确的问题而继续烦你。
现在，我回到我之前的问题，从你附上的图片来看，基板的高度是200um和100um，还是200um和300um？
谢谢，Mojtaba



     以下为原文

  Sorry Volker for keep bugging you for this probably very clear question. Now, I return to my previous question, from the picture you attached, the substrates' height are 200um and 100um or they are 200um and 300um?

Thanks,

Mojtaba

> {quote：title = Mojtaba77写道：} {quote}>现在，我回到我之前的问题，从你附上的图片来看，基板的高度是200um和100um，还是200um和300um？
my_sub2厚度为200μm，my_sub1厚度为200μm+100μm=300μm



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}
> Now, I return to my previous question, from the picture you attached, the substrates' height are 200um and 100um or they are 200um and 300um?


my_sub2 thickness is 200µm 
my_sub1 thickness is 200µm + 100µm = 300µm

> {quote：title = Mojtaba77写道：} {quote}>好的，附图是我用氧化铝和FR4定义的基材，高度均为15密耳。
模拟器如何理解氧化铝用于cond而FR4用于cond2？
模拟器不理解它。
它不需要理解它。
你绘制金属，然后在不同的基板上绘制导体。
模拟器只需将导体置于z = 15mil的高度。
然后在下面有氧化铝或FR4，具体取决于那里定义的介电通孔。
正如我上面所写，你不需要两个金属层。
如果基板高度相同，则可以对两个基板使用相同的金属。
如果它们映射到不同的高度，您只需要两个金属层。
但是如果你想使用两个金属层，并将它们都映射，那也没关系。



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}
> OK, the attached figure is the substrate I have defined with Alumina and FR4 with both height of 15 mil. How the simulator understand Alumina is for cond and FR4 is for cond2?

The simulator does not understand it. It does not need to understand it. YOU draw the metal, and YOU draw the conductors over the different substrate. The simulator will just place the conductor at z=15mil height. And then there is Alumina or FR4 below, depending on the dielectric vias defined there.

As I already wrote above, you do not need two metal layers. You can use the same metal for both substrates, if the substrate height is the same. You only need two metal layers if they are mapped at different heights. But if you wish to use two metal layers, and map them both, that is also ok.

嗨Volker，非常感谢。
我只想弄清楚基板叠加中的所有内容。
现在我明白你的意思了;
我们有两个部分，一个在基板定义中，第二个部分应该在布局中完成。
最诚挚的问候，Mojtaba



     以下为原文

  Hi Volker,

Thanks a lot. I was just trying to figure out everything in substrate stackup. Now I understand what you mean; we have two parts, one in substrate definition and second part it should be done in layout.

Best Regards,

Mojtaba

嗨，我不知道我们的电子邮件发生了什么，所以我把我的最后一个问题放在这里;
对于以下基材，模拟器如何说氧化铝用于cond而FR4用于cond2？
谢谢，Mojtaba



     以下为原文

  Hi, I do not know what happened to our emails so I put my last question here; for the following substrate how simulators can say the Alumina is for cond and FR4 is for cond2?

Thanks,

Mojtaba

> {quote：title = Mojtaba77写道：} {quote}>我从你的描述和图片中了解到，你已经定义了两种高度为200和300微米的材料。
现在，如果我想要达到我应该做的同样的高度。
这更容易。
定义两个具有相同高度的介电通孔。
在这种情况下，您可以使用相同的金属层在两个基板上绘制导体，因为它们处于相同的高度（相同的z位置）。



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}

> What I understand from your description and pictures, you have defined two materials with height 200 and 300 um. Now if I want to have same heights what I should do. 

That is even easier. Define two dielectric vias with the same height. In this case, you can use the same metal layer for drawing the conductor on both substrates, because they are at the same height (same z position).

> {quote：title = Mojtaba77写道：} {quote}>我从你的描述和图片中了解到，你已经定义了两种高度为200和300微米的材料。
现在，如果我想要达到我应该做的同样的高度。
这更容易。
定义两个具有相同高度的介电通孔。
在这种情况下，您可以使用相同的金属层在两个基板上绘制导体，因为它们处于相同的高度（相同的z位置）。



     以下为原文

  > {quote:title=Mojtaba77 wrote:}{quote}

> What I understand from your description and pictures, you have defined two materials with height 200 and 300 um. Now if I want to have same heights what I should do. 

That is even easier. Define two dielectric vias with the same height. In this case, you can use the same metal layer for drawing the conductor on both substrates, because they are at the same height (same z position).