[问答]

PSoC 6 MCSP封装修改？

1461 GPIO

问答对人有帮助，内容完整，我也想知道答案 0 你好，我希望通过我做的修改来检查我的足迹（除去我们不使用的GPIO的各种垫片）。我以前有过类似的修改，但现在更喜欢让你们验证。我知道这远不是理想的，但这只是为了让我们一直等到今年晚些时候我们能拿到QFN计划。所以问题是，这些垫移除会使它非常不稳定吗？（机械的和电的）。谢谢大家以上来自于百度翻译以下为原文 Hello there, I was hoping to get my footprint reviewed with the modifications I made (removal of various pads of GPIO's we aren't using). I have had success before with similar modifications but prefer to have it verified by you guys now. I know it's far from ideal but this is just to get us by until we can get our hands on the QFN package later this year. So the question, do these pad removals make it extremely unstable? (Both mechanically and electrically). Thank you guys 0
2018-9-27 14:30:54　　评论淘帖0 邀请回答您可以邀请以下用户，快速回答问题 × 36切53 该类别下有 65 个回答。邀请回答 hnui2002 该类别下有 50 个回答。邀请回答细水爱长流该类别下有 33 个回答。邀请回答不cdvdhgdh 该类别下有 31 个回答。邀请回答 iwuwjgj 该类别下有 26 个回答。邀请回答 cslb2000 该类别下有 25 个回答。邀请回答 ggfx 该类别下有 23 个回答。邀请回答珠海易胜该类别下有 23 个回答。邀请回答 hrtuoyu 该类别下有 22 个回答。邀请回答 h1654155958.0210 该类别下有 22 个回答。邀请回答 ncmza 该类别下有 21 个回答。邀请回答 shaoye88 该类别下有 21 个回答。邀请回答 april_yu 该类别下有 20 个回答。邀请回答瑾年Invader 该类别下有 20 个回答。邀请回答望望Ll 该类别下有 20 个回答。邀请回答 zkzk196599 该类别下有 19 个回答。邀请回答 nvwuwy 该类别下有 18 个回答。邀请回答 lucas_songlea 该类别下有 18 个回答。邀请回答 cmh22 该类别下有 17 个回答。邀请回答 fan7572 该类别下有 17 个回答。邀请回答举报王宁相关推荐 • PSoC 6只有BGA、WLCSP和MCSP作为器件封装吗 2572 • 封装修改后不能导入pads layout 9778 • allergo元件的封装修改 21461 • S8加上PSOC 6模块上的广告扩展怎么修改 1043 • 按时如何在PSoC6中复用？ 1783 • PSoC 6是否支持CAN？ 1439 • PSOC6 BootLoader 2145 • 何时使用Psoc 6来支持EmFile组件？ 1289 • 我需要Keil用于PSoC 4和/或PSoC 6吗？ 2875 • 修改封装 4209 1个回答

答案对人有帮助，有参考价值 0 你好，我与我们的硬件工程师进行了检查，他们认为这些拆卸会使包装机械不稳定，如果选择汽车PCB组装，可能会导致非常差的焊接成品率。一些评论 1。尽可能多地填充球以提高稳定性。 2。确保没有准确的痕迹在被移除的球下面-因为它可能导致短裤，如果层绝缘了微量的珠子（甚至在制造过程中）三。确保你已经填充了所有的供应/ GND球，并将它们连接到外部。由于供应不是内部短路，你将不得不将它们连接到外部。当做， Meenakshi Sundaram R 以上来自于百度翻译以下为原文 Hello, I checked with our hardware engineers and they felt that these many removals will make the package mechanically unstable and might result very poor soldering yield if you opt for auto PCB assembly. Some comments - 1. Populate as many more balls as you can to increase the stability. 2. Make sure there are no traces exactly below the removed balls - As it may result in shorts, if the layer insulating the trace peals off (even during manufacturing) 3. Make sure you have populated all supply/GND balls and connected them externally. As supplies are not shorted internally and you will have to connect them externally. Regards, Meenakshi Sundaram R

2018-9-27 14:39:51 评论举报张帆