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AN-107Manual Soldering Technique For Z-COMM VCOsThis note describes common manufacturing methods used to solder Z-COMM surface mount and pinmount VCOs. Following the suggested practices will ensure optimum performance and repeatedproduct reliability.Surface Mount VCOsThe Mini, Sub-Mini, and S package devices can be soldered manually or through an automated process.Recommendations for both approaches are detailed below.Manual ProcessApply solder to the half-moon connections around the periphery of the VCO package (see FigureAN-107:1). Once the device's ground plane is heated, connection will normally require 5 seconds orless. For proper grounding, all of the contacts must be soldered. Care must be taken to ensure goodsolder connections without applying excess solder. Also, iron contact with VCO should be executedquickly to prevent heat damage.
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