请问CPG196封装的最大压力处理能力是多少？

Y，
包装是非密封的，因此压力将相等。
空隙中残留的任何残留气体都很小（存在于基板中）。
您尝试设计的环境是什么？
Austin Lesea主要工程师Xilinx San Jose



以下为原文

y,
 
The package is non-hermetic, so the pressure will equalize.
 
Any residual trapped gasses in voids is vanishingly small (present in the substrate).
 
What environment are you attempting to design for?
 
 
Austin Lesea
Principal Engineer
Xilinx San Jose

嗨奥斯汀， 
谢谢您的回答。
我不关心环境压力，但是在包装顶部施加直接机械压力。
FPGA将安装在安装在相机内的PCB上。
我想放一个导热垫来填补FPGA和机箱背面之间的空隙。
导热垫将被压缩，因此将在CPG196封装上施加恒定压力。
我想确保不超过包装压力处理能力。
对于其他Xilinx封装，每个球CPG196手动5g，还是不同？ 
谢谢， 
雅尼克。



以下为原文

Hi Austin,
 
  Thank you for your answer. I'm not concerned about environmental pressure, but with direct mechanical pressure applied on top of the package. The FPGA will be mounted on a PCB installed inside a camera. I want to put a thermal pad to fill the gap between the FPGA and the back of the enclosure. The thermal pad will be compressed and will therefore be applying constant pressure on the CPG196 package. I want to make sure I don't exceed the package pressure handling capability.
 
  Will CPG196 handle 5g per ball as for other Xilinx packages, or is it different?
 
  Thanks,
  Yannick.

CPG是BGA封装（ug112的第17页），BGA封装的压力处理能力是5g /球（ug112的第119页）。
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以下为原文

CPG is BGA package (page 17 of ug112) and pressure handling capacity of BGA package is 5g/ball (page 119 of ug112).

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谢谢您的回答。
关于这个话题我还有另一个问题;
由于焊盘尚未压缩，因此散热垫通常会在安装时在芯片上施加更大的压力。
随着热材料的扩散，压力将减小。
在安装过程中，安全时间是否会超过5g /球，但在此之后永远保持在5g /球之内？
我很担心，因为这5g / ballmax似乎是一个非常有限的因素。
我相信大多数人通常不会关心这一点，但是如果你开始使用热界面数据表中的压缩/力数来进行数学计算，很多人会意识到它们超过5g /球。
世界上任何使用Xilinx BGA上的导热垫的人都会遇到故障，这听起来不对，所以我想知道5g / ballnumber是否真的正确......？
谢谢，
雅尼克。



以下为原文

Thank you for your answer.
 
I have another question on this topic; Thermal pads will typically apply more pressure on the chip at the moment of installation because the pad is not yet compressed. The pressure will diminish as the thermal material spreads around. Is it safe to exceed 5g/ball for a few seconds during installation, but remain within 5g/ball forever after?
 
I am concerned because this 5g/ball max seems like a very constraining factor. I believe most people don't usually care about this, but if you start doing the maths using compression/force numbers from thermal interface datasheets, many would realize they're exceeding 5g/ball. It doesn't sound right that anyone in the world who uses a thermal pad on a Xilinx BGA would encounter failures so I wonder if the 5g/ball number is truly right...?
 
Thanks,
Yannick.