SPI启动在低温下失败？

我们已经注意到在低温下启动FX3的一些问题。我们有一个产品上使用CysB3014-BZXI，它使用了一个从24FC256I/SN正确加载的I2C引导加载程序。注TTAT板上的所有其他部分也额定为全工业温度范围。这个引导装载器查看附加的SPIFFlash（微米N25Q128A11B1240E）以获得更大的启动映像。
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在室温下，这个过程运行良好。SPIGION被加载并引导FX3。设备正确枚举。
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在低温度（接近0C）时，引导加载程序无法从SPI中检索图像。失败后，它被设计为枚举自己的设备，并且可以接受非常有限的指令。
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到目前为止，这些都是现场故障，目前还没有在实验室进行评估。我们没有太多的信息，但想看看是否有人经历过这一点。



     以下为原文
  We have noticed some issues with booting the FX3 at low temperatures.  We have the CYUSB3014-BZXI on a product which uses an I2C bootloader that is loading correctly from a 24FC256-I/SN.  Note thtat all other parts on the board are also rated for the full industrial temperature range.  This bootloader looks to the attached SPI Flash (Micron N25Q128A11B1240E) for a larger boot image.
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    At room temperatures, this process has worked fine.  The SPI image is loaded and boots the FX3.  The device correctly enumerates.
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    At low temperatures (approaching 0C), the bootloader fails to retrieve the image from SPI.  Upon failure, it is designed to enumerate as its own device and can accept very limited instructions.
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    These have been field failures so far and not evaluated in the lab just yet.  We don't have too much information yet but wanted to see if anyone else had experienced this.