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我需要帮助才能找到xilinxcomponents中的热数据:
Tj - 器件的最高结温。 Ta - 环境温度。 Tc - 设备的外壳温度 在下一个组件中: 1. Virtex-6 XC6VLX75T - FF784 2. Virtex-5 XC5VLX50 - FF676 谢谢 以上来自于谷歌翻译 以下为原文 I need help to find thermal data in xilinx components: Tj - maximum junction temperature of the device. Ta - ambient air temperature. Tc - case temperature of the device In next components: 1. Virtex-6 XC6VLX75T - FF784 2. Virtex-5 XC5VLX50 - FF676 Thanks |
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6个回答
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请通过以下链接查看数据
http://www.xilinx.com/cgi-bin/thermal/thermal.pl -------------------------------------------------- ----------------------------别忘了回复,给予kudo并接受为解决方案--------- -------------------------------------------------- ------------------- 以上来自于谷歌翻译 以下为原文 Please check the data at the following link http://www.xilinx.com/cgi-bin/thermal/thermal.pl ------------------------------------------------------------------------------ Don't forget to reply, give kudo and accept as solution ------------------------------------------------------------------------------ |
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谢谢,
但这个页面中的信息不够。 它在结和环境/外壳之间的电阻, 我需要在接头,外壳和环境温度。 以上来自于谷歌翻译 以下为原文 Thanks, But its not enough information in this page. Its resistanse between junction and ambient/case, i need temperature in junction, case and ambient. |
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olegg写道:
我需要在接头,外壳和环境温度。 您可以指定环境温度和设备功率。 将功率(W)乘以热阻 - 通常标记为Theta J-A - (deg C / W),产品从环境温度升温。 Temp(junc)=(W * Theta J-A)+ Temp(环境) Theta J-A是响应原始帖子链接的“封装热”小程序生成的热阻。 基于功率(W),Theta J-C和壳体温度对结温进行类似的计算。 - 鲍勃埃尔金德 签名:新手的自述文件在这里:http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结:1。 阅读手册或用户指南。 你读过手册了吗? 你能找到手册吗?2。 搜索论坛(并搜索网页)以寻找类似的主题。 不要在多个论坛上发布相同的问题。 不要在别人的主题上发布新主题或问题,开始新的主题!5。 学生:复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。 提供有用的详细信息(请与网页,数据表链接).7。 您的代码中的评论不需要支付额外费用。 我没有支付论坛帖子的费用。 如果我写一篇好文章,那么我一无所获。 以上来自于谷歌翻译 以下为原文 olegg wrote:You specify the ambient temp and device power. Multiply the power (W) by the thermal resistance - usually labeled Theta J-A - (deg C/W), product is thermal rise from ambient temperature. Temp(junc) = (W * Theta J-A) + Temp(ambient) Theta J-A is the thermal resistance generated by the 'package thermal' applet linked in response to your original post. Similar calculations are made for junction temperature based on power (W), Theta J-C, and case temperature. - Bob Elkind SIGNATURE: README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369 Summary: 1. Read the manual or user guide. Have you read the manual? Can you find the manual? 2. Search the forums (and search the web) for similar topics. 3. Do not post the same question on multiple forums. 4. Do not post a new topic or question on someone else's thread, start a new thread! 5. Students: Copying code is not the same as learning to design. 6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please). 7. You are not charged extra fees for comments in your code. 8. I am not paid for forum posts. If I write a good post, then I have been good for nothing. |
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谢谢鲍勃,我做这个计算,但结果是不现实的。
Tj = 85(c),W = 8(w),θj-a = 11.8(c / w)=> Ta = -3(c)!!! 问题:MaximumTj(结点温度)必须是恒定的? (我从xilinx数据表中获取此信息) 以上来自于谷歌翻译 以下为原文 Thanks Bob, I do this calculation, but results is no realistic. Tj =85 (c) , W=8(w), Theta j-a = 11.8 (c/w) => Ta= -3 (c) !!! Question: Maximum Tj ( temperature in junction) must be constant? (I take this from xilinx datasheet) |
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olegg写道:
谢谢鲍勃,我做这个计算,但结果是不现实的。 Tj = 85(c),W = 8(w),θj-a = 11.8(c / w)=> Ta = -3(c)!!! 问题:MaximumTj(结点温度)必须是恒定的? (我从xilinx数据表中获取此信息) Olegg, 结果是不现实的,因为它表明你有热问题? 或者不切实际,因为您不相信Xilinx applet报告的封装热性能? 如果Theta J-A是11.8,功率是8W,你肯定有问题。 要么Theta J-A错了,要么你需要重新思考你的设计。 你的8W功率数字有多现实? 您是否通过测量(而非模拟或估算)验证了这一点? 好消息是Theta J-C非常低(0.3C / W),这意味着散热器应该非常有效。 建议(以下一项或多项): 1.散热器(哪个封装有最好的Theta J-C?) 2.设计缩小 3.通过封装球和电源层使用多层PCB作为散热器 4.工业(扩展)温度范围部件 - 鲍勃埃尔金德 签名:新手的自述文件在这里:http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结:1。 阅读手册或用户指南。 你读过手册了吗? 你能找到手册吗?2。 搜索论坛(并搜索网页)以寻找类似的主题。 不要在多个论坛上发布相同的问题。 不要在别人的主题上发布新主题或问题,开始新的主题!5。 学生:复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。 提供有用的详细信息(请与网页,数据表链接).7。 您的代码中的评论不需要支付额外费用。 我没有支付论坛帖子的费用。 如果我写一篇好文章,那么我一无所获。 以上来自于谷歌翻译 以下为原文 olegg wrote:Olegg, Are the results unrealistic because it shows you have a thermal problem? Or unrealistic because you don't believe the package thermal properties reported by the Xilinx applet? If Theta J-A is 11.8, and power is 8W, you definitely have a problem. Either the Theta J-A is wrong, or you need to re-think your design. How realistic is your 8W power figure? Have you verified this with measurements (rather than simulation or estimation)? The good news is that Theta J-C is very low (0.3C/W), which means that a heatsink should be highly effective. Suggestions (1 or more of the following): 1. heatsink (which package has best Theta J-C?) 2. design scaled down 3. use multi-layer PCB as thermal sink via package balls and power planes 4. industrial (extended) temp range parts - Bob Elkind SIGNATURE: README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369 Summary: 1. Read the manual or user guide. Have you read the manual? Can you find the manual? 2. Search the forums (and search the web) for similar topics. 3. Do not post the same question on multiple forums. 4. Do not post a new topic or question on someone else's thread, start a new thread! 5. Students: Copying code is not the same as learning to design. 6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please). 7. You are not charged extra fees for comments in your code. 8. I am not paid for forum posts. If I write a good post, then I have been good for nothing. |
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>我做这个计算,但结果是不现实的。
你必须是热考虑的新手。 8瓦特对于设备而言是一个重要的功率负载,并且静止空气不会提供太多的散热。 我建议您阅读以下材料,以了解有关热建模和散热器选择的更多信息。 WP258 - 散热器选择的注意事项 UG112 - 器件封装指南(热管理部分) ------您是否尝试在Google中输入问题? 如果没有,你应该在发布之前。太多结果? 尝试添加网站:www.xilinx.com 以上来自于谷歌翻译 以下为原文 >I do this calculation, but results is no realistic. You must be new to thermal considerations. 8 Watts is a signifcant power load for a device and still air does not provide for much heat dissipation. I would suggest that you read the following material to learn more about thermal modeling and heatsink selection. WP258 - Considerations for Heatsink Selection UG112 - Device Package Guide (Thermal Management Section) ------Have you tried typing your question into Google? If not you should before posting. Too many results? Try adding site:www.xilinx.com |
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