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大家好,我正在模拟板载芯片(COB)测试系统的S参数。
PCB参数规格如下:1。介电常数= 4.4(三菱材料)2。损耗角正切= 0.006 3. PCB厚度= 0.25 mm(0.001英寸)4。迹线厚度(高度)= 7um迹线布局png图像 也附上。 我正在运行从100 Mhz到25 Ghz的模拟。 收集从布局窗口获得的结果,并使用差分配置在示意图窗口中重新模拟它。 还附有测试机制。 但它显示出一些奇怪的结果。 S11应该擅长100 Mhz。 显示S11的100 Mhz为-1.16 dB。 当我以微米厚度35微米运行时,模拟非常精细。 我重新计算所有尺寸为7微米,但是7微米的结果并不好。 任何人都可以帮我找出7微米结果不好的原因。 resluts.png177.3 KBlayout.png240.8 KB 以上来自于谷歌翻译 以下为原文 Hello all, I am simulating S-parameters for chip on board(COB) testing system. Specification of the PCB parameters are as follows: 1. Dielectric constant = 4.4 (Mitsubishi material) 2. loss tangent = 0.006 3. PCB thickness = 0.25 mm (0.001 inch) 4. Trace thickness(height) = 7um The trace layout png image is also attached. I am running simulations from 100 Mhz to 25 Ghz. Results obtained from layout window were collected and re-simulate it in schematic window using differential configuration. Testing mechanism is also attached. But it is showing some weird results. S11 should be good at 100 Mhz. It is showing S11 at 100 Mhz is -1.16 dB. Simulations are perfectly fine when I was running at Trace thickness 35 um. I recalculate all dimensions at 7 um, but at 7 um result was not fine. Can anybody help me to find out the reason why at 7 um results are not fine. 附件
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> {quote:title = Mukul Ratwani写道:} {quote}>当我在追踪厚度35微米的情况下运行时,模拟完全没问题。
我重新计算所有尺寸为7微米,但是7微米的结果并不好。 像这样的厚度应该没有直接影响。 更新尺寸时,图形中可能会出现一些小错误。 检查输入阻抗(低频时是开路还是短路?)检查电流密度视图,这有助于查看问题所在。 以上来自于谷歌翻译 以下为原文 > {quote:title=Mukul Ratwani wrote:}{quote} > Simulations are perfectly fine when I was running at Trace thickness 35 um. I recalculate all dimensions at 7 um, but at 7 um result was not fine. There should be no direct effect from thickness like this. It might be some small mistake in your drawing when you updated dimensions. Check input impedance (open or short at low frequency?) Check the current density view, this will help to see where the problem is. |
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