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我想使用ADS2011.10进行两层金属化EM仿真。
我在使用ADS2011.10生成EM仿真和两层金属化的布局生成时遇到了以下困难1）我想获得两层金属化，如TWO_LAYER_LAYOUT_EXAMPLE的屏幕截图所示。 我没有得到如TWO_LAYER_LAYOUT_EXAMPLE的屏幕截图所示。 当我打开并查看3D时，获取3D视图，如3D_View_Two_Layer_Metalization的屏幕截图所示。 如何获得两层金属化3D，如TWO_LAYER_LAYOUT_EXAMPLE的屏幕截图所示。 2）在基板视图中，我们可以得到两层金属化，如TWO_LAYER_LAYOUT_EXAMPLE的屏幕截图所示。 如果是这样，我们如何获得，可以做什么修改来获得。 3）我使用ADS2011.10生成EM仿真用于双层金属化。 我附加了两层金属化的.Zap文件，它显示在EM_Simulation_2_wrk.7zap中。 无论我为两个金属化EM仿真做了什么，都是正确的。 如果它错了，我做了什么错，你能告诉我吗？ 你能澄清一下上面的困难Substrate_View.jpg133.6 KB3D_View_Two_Layer_Metalization.jpg168.6 KBEM_Simulation_2_wrk.7zap60.7 KB 以上来自于谷歌翻译 以下为原文 I want to do two layer metalization EM Simulation using ADS2011.10. I am getting following difficulties while generating EM Simulation and layout generation of two layer metalization using ADS2011.10 1) I want to get the two layer metalization as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. I am not getting as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. When I opened and viewed 3D, Obtained 3D view as shown in the screen shot of 3D_View_Two_Layer_Metalization. How to get the two layer metalization 3D as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. 2) In the substrate view, can we get the two layer metalization as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. If so, how we can get, what modification can be done to obtain. 3) I generated the EM Simulation using ADS2011.10 for two layer metalization. I have attached the .Zap file of two layer metalization, which is shown in EM_Simulation_2_wrk.7zap. Whatever I have done for the two metalization EM simulation, is it correct. If it is wrong, what mistake I have done, can you show me. Can you clarify above difficulties 附件
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> {quote：title = sdgrant写道：} {quote}>你将底板定义中的底板设置为Cover，它提供了一个连续的金属层。 要查看双侧板配置，您需要将其设置为条带平面，并将cond2金属化映射到电路板的那一侧。 我必须去哪里更改选项以获得双面配置。 你能建议我吗？ 发布＃1中的其他点困难怎么样？ 以上来自于谷歌翻译 以下为原文 > {quote:title=sdgrant wrote:}{quote} > You have the bottom of the board in the substrate definition set as Cover, that gives a continuous metal layer. To see double side board configuration you need to set that instead as a strip plane and map the cond2 metalization to that side of the board. Where I have to go and change the options to get the double side configuration. Can you suggest me. What about other points difficulties in the posting #1. |
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2018-10-10 17:37:56
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hu_wflllllllg21 发表于 2018-10-1 11:58 它全部设置在基板定义中。 你称之为substrate1的那个。 只需按照我之前的描述进行编辑，以显示两侧带导体的基板，顶部为cond，底部为cond2，而不使用覆盖导体。 以上来自于谷歌翻译 以下为原文 It's all set in the substrate definition. The one you called substrate1. Just edit that as I outlined previously to show a substrate with conductor on both sides, cond on the top and cond2 on the bottom, and not using a cover conductor. |
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411easdd*** 发表于 2018-10-1 12:11 正如你所说，我做到了。 但它显示与之前相同。 这里我附上了.zap文件。 看看一次，你能找到我犯错误的地方。 以上来自于谷歌翻译 以下为原文 As you said I did it. But it is showing same as like earlier. Here with I attached the .zap file. Have look on once and can you find where I am making mistake. 附件
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2018-10-10 18:06:08
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您尚未正确完成基材设置。 您已将cond2设置为下层接口的“Bounding area layer”，而未使用cond2将条带层映射到该接口。 因此，在基板编辑器中选择较低的界面，并将“边界区域图层”设置为无。 然后，对于此下部界面，右键单击并设置“Map Condictor Layer”并配置cond2，其中包含所有必需的材料和厚度属性。 保存并退出基板编辑器，它应该工作。 以上来自于谷歌翻译 以下为原文 You have not done the substrate setup correctly. You have set cond2 as the "Bounding area layer" for the lower interface and not mapped a strip layer using cond2 to that interface. So in the substrate editor select the lower interface and set the "Bounding area layer" back to none. Then for this lower interface right click and set "Map Condictor Layer" and configure cond2 with all the required material and thickness properties. Save and exit the substrate editor and it should work. |
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411easdd*** 发表于 2018-10-1 12:31 现在我正在按照我的意愿获得两层金属化的3D视图。 感谢您的帮助，直到我获得所需的3D视图。 这里我附加两层金属化“.zap”文件的EM模拟。 我使用ADS2011.10模拟EM进行双层金属化。 我是ADS2011.10的新手，用于双层金属化EM仿真。 我已经完成了两次金属化的EM仿真。 我要求您检查两层EM仿真的“.Zap”，并判断它是否适用于两层金属化的EM仿真的所有设置。 如果有任何错误，你能指出我吗？ 你可以帮我吗。 以上来自于谷歌翻译 以下为原文 Now I am getting the 3D view of two layer metalization as I desire. Thank you for your help till I got the desired 3D view. Here with I am attaching EM simulation of two layer metalization ".zap" file. I have EM simulated using ADS2011.10 for two layer metalization. I am new to this ADS2011.10 for two layer metalization EM simulation. I have already done the EM Simulation for two layer metalization. I request you to check once the ".Zap" of two layer EM simulation and tell whether it is correct for all settings of EM Simulation of two layer metalization. If there is any mistake, can you point out me. Can you help me. 附件
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2018-10-10 18:19:49
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hu_wflllllllg21 发表于 2018-10-1 12:40 我无法提供有关设计细节的建议，但是Via焊盘小于它们连接的传输线，cond2切口太小而且几乎接触底部通孔焊盘，EM端口上的GND引脚未正确定义（“没有指定显式引脚 在基板中没有定义无限的接地层或槽层时，这个端口设置会导致“根据ADS 2015.01中的气球帮助信息”的不准确或非物理结果。 我不会做很多事情，但是这些“错误”还是糟糕的设计选择？ 仅供参考 - 您不需要两个子类定义，基板1和基板2。 只需要基板1，这是唯一使用的基板。 以上来自于谷歌翻译 以下为原文 I cannot advise on the specifics of the design but Via pads that are smaller than the transmission lines they are joined to, cond2 cutout too small and almost touching bottom via pads, GND pins on EM port not correctly define ("No explicit pin is assigned to minus terminal while there are no infinite ground or slot layers defined in the substrate. This port setup can lead to inaccurate or unphysical results" according to balloon help message in ADS 2015.01). There are many things that I would not do but are these 'mistakes' or just bad design choices? FYI - you do not need two subsstrate definitions, substrate1 and substrate2. Only substrate1 is required and that is the only one used. |
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