MAC地址的变化取决于PSoC Creator版本？

我们一直在使用PSoC创建者4为我们的BLE广播公司项目。在“间隙设置”中检查“硅生成”公司指定的“设备地址的一部分”选项。项目中的BLE组件版本为2.10。
最近我使用PSoC创建者4.2（加载同一个项目）运行了相同代码的构建。它更新了BLE组件到V3.51。我验证了BLE组件中的所有选项都是相同的。
我们的问题是这样的：BLE MAC地址是不同的（恒）根据图像我们加载固件。那就是，如果我们负荷4.0-based建立我们得到一个MAC地址。如果我们负荷4.2建立在同一设备上我们得到一个不同的MAC地址。
我们不是编写自定义MAC地址的用户Flash排0。我们宁愿不必这样做。
我的理解是，随着“硅产生的公司分配部分的设备地址”选项选中，MAC地址应该是一个对模具制造的各个方面的功能（x &；Y位置，晶片的晶片数量很多，，等）。如果是这样的话，那么MAC地址不可改变。
谁能告诉我为什么地址是两编译图像之间的不同吗？
感谢您提供的任何洞察力。



     以下为原文
  We've been using PSoC Creator 4.0 for our BLE Broadcaster project.  The option "Silicon generated 'Company assigned' part of the device address" is checked in the GAP settings.  The BLE component version in the project is 2.10.

I recently ran a build of the same code using PSoC Creator 4.2 (loading the same project).  It updated the BLE component to v3.51.  I verified that all options in the BLE component are set the same.

Our problem is thus: The BLE MAC address is different (and constant) depending on which firmware image we load.  That is, if we load the 4.0-based build we get one MAC address.  If we load the 4.2-based build on the same device we get a different MAC address.

We are not writing a custom MAC address to user flash row 0.  We'd prefer to not have to.

My understanding is that with the "Silicon generated 'Company assigned' part of the device address" option checked, the MAC address should be a function of various aspects of the die's manufacturing (X & Y location, wafer lot, wafer number, etc).  If that is that case, then the MAC address shouldn't be changing.

Can anyone tell me why the address is different between the two compiled images?

Thanks for any insight you can offer.