晶圆级封装技术,Wafer Level Package Technology

晶圆级封装技术Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devicesInternational Rectifier’s Wafer Level Package (WLP)devices combine the latest die design with newpackaging techniques to occupy the smallestpossible footprints. The first products to use WLPtechnology are the FlipFET? range of HEXFET?Power MOSFET devices, in which a modified diedesign places the drain as well as the gate andsource contacts on the front face of the die. Packagefootprints for these devices are typically one-thirdthose of small outline packages with equivalentperformance.To simplify board mounting and improve reliability,International Rectifier manufactures WLP devices toexacting standards. These high standards haveevolved through evaluating many different materialsand designs. Although such evaluations have yieldedgood results, the recommendations in thisapplication note may need to be adjusted to suitspecific production environments.