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Automotive excellence achieved by the first 100% solder-free high power IGBT module
A new high power IGBT module optimized for the requirements of automotive applications will be introduced. It is the first 100% solder free isolated IGBT module in the market. The pressure contact technology was introduced by Semikron in 1992. At that time Semikron introduced an IGBT module without base plate. (SKiiP – Technology) No solder process between the DCB and base plate was necessary. The contact of the power and auxiliary terminals to the DCB was not soldered. A new pressure system replaced the conventional solder system. Good reliability and low thermal impedance was the result. 15 years later Semikron will introduce a base plate less IGBT module without any solder process. Actually the IGBT chip is soldered to the DCB but in the new IGBT module new sinter technology is used to connect the IGBT chip to the DCB. A solder joint degrades during load cycles, which will lead to increased thermal resistance and module failure. The sinter joint is a thin silver layer that has a superior thermal resistance than solder and at the same time due to the high melting point of silver (960 degree) no joining fatigue can be observed leading to an increased life time of the over all system. Semikron could combine the SKiiP-Technology with the Sinter technology and the result is SKiM, a new solder free IGBT module. [3] 
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[此贴子已经被作者于2009-10-6 14:49:06编辑过]
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