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1. 附件:attached 2. 样品:sample 3. 承认:approval 4. 答复:answer;reply 5. 规格:spec 6. 与...同样的:the same as 7. 前版本:previous version(old version) 8. 生产:production 9. 确认:confirm 10. 再次确认:doubleconfirm 11. 工程问题:engineering query(EQ) 12. 尽快:ASAP(as soon as possible) 13. 生产文件:production gerber 14. 联系某人:contact somebody 15. 提交样板:submit sample 16. 交货期:delivery date 17. 电测成本:ET(electrical test) cost 18. 通断测试:Open and shorttesting 19. 参考:refer to 20. IPC标准:IPC standard 21. IPC二级:IPC class 2 22. 可接受的:acceptable 23. 允许:permit 24. 制造:manufacture 25. 修改:revision 26. 公差:tolerance 27. 忽略:ignore(omit) 28. 工具孔:toolinghole 29. 安装孔:mountinghole 30. 元件孔:componenthole 31. 槽孔:slot 32. 邮票孔:snapoff hole 33. 导通孔:via 34. 盲孔:blind via 35. 埋孔:buriedvia 36. 金属化孔:PTH(platingthrough hole) 37. 非金属化孔:NPTH(no plating through hole) 38. 孔位:holelocation 39. 避免:avoid 40. 原设计:originaldesign 41. 修改:modify 42. 按原设计:leaveit as it is 43. 附边:wastetab 44. 铜条:copperstrip 45. 拼板强度:panelstrong 46. 板厚:boardthickness 47. 删除:remove(delete) 48. 削铜:shavethe copper 49. 露铜:copperexposure 50. 光标点:fiducialmark 51. 不同:bedifferent from(differ from) 52. 内弧:insideradius 53. 焊环:annularring 54. 单板尺寸:singlesize 55. 拼板尺寸:panelsize 56. 铣:routing 57. 铣刀:router 58. V-cut:scoring 59. 哑光:matt 60. 光亮的:glossy 61. 锡珠:solderball(solder plugs) 62. 阻焊:soldermask(solder resist) 63. 阻焊开窗:soldermask opening 64. 单面开窗:singleside mask opening 65. 补油:touchup solder mask 66. 补线:trackwelds 67. 毛刺:burrs 68. 去毛刺:deburr 69. 镀层厚度:platingthickness 70. 清洁度:cleanliness 71. 离子污染:ioniccontamination 72. 阻燃性:flammabilityretardant 73. 黑化:blackoxidation 74. 棕化:brownoxidation 75. 红化:redoxidation 76. 可焊性:solderability 77. 焊料:solder 78. 包装:packaging 79. 角标:cornermark 80. 特性阻抗:characteristicimpedance 81. 正像:positive 82. 负片:negative 83. 镜像:mirror 84. 线宽:conductorwidth 85. 线距:conductorspacing 86. 做样:buildsample 87. 按照:as per 88. 成品:finished 89. 做变更:make the change 90. 相类似:similar to 91. 规格:specification 92. 下移:shiftdown 93. 垂直地:vertically 94. 水平的:horizontally 95. 增大:increase 96. 缩小:decrease 97. 表面处理:SurfaceFinishing 98. 波峰焊:wavesolder 99. 钻孔数据:drillingdate 100. 标记:Logo 101. Ul标记:Ul Marking 102. 蚀刻标记:etchedmarking 103. 周期:datecode 104. 翘曲:bowand twist 105. 外层:outerlayer 106. 内层:internallayer 107. 顶层:toplayer 108. 底层:bottomlayer 109. 元件面:componentside 110. 焊接面:solder side 111. 阻焊层:solder mask layer 112. 丝印层:legendlayer (silkscreen layer or over layer) 113. 兰胶层:peelableSM layer 114. 贴片层:pastemask layer 115. 碳油层:carbonlayer 116. 外形层:outlinelayer(profile layer) 117. 白油:whiteink 118. 绿油:greenink 119. 喷锡:hotair leveling (HAL) 120. 水金:flashgold 121. 插头镀金:platedgold edge-board contacts 122. 金手指:Gold-finger 123. 防氧化:Entek(OSP) 124. 沉金:Immersiongold (chem. Gold) 125. 沉锡:ImmersionTin(chem.Tin) 126. 沉银:ImmersionSilver (chem. silver) 127. 单面板:singlesided board 128. 双面板:doublesided board 129. 多层板:multilayerboard 130. 刚性板:rigidboard 131. 挠性板:flexibleboard 132. 刚挠板:flex-rigidboard 133. 铣:CNC(mill , routing) 134. 冲:punching 135. 倒角:beveling 136. 倒斜角:chamfer 137. 倒圆角:fillet 138. 尺寸:dimension 139. 材料:material 140. 介电常数:Dielectric constant 141. 菲林:film 142. 成像:Imaging 143. 板镀:PanelPlating 144. 图镀:PatternPlating 145. 后清洗:FinalCleaning 146. 叠层:layup(stack-up) 147. 污染焊盘:contaminatepad 148. 分孔图:drillchart 149. 度数:degree 150. 被…覆盖:be covered with 151. 负公差:minustolerance 152. 标靶盘:target pad 153. 外形公差:routingtolerance 154. 芯板:core |
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