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u*** 3.0标准规范下载 -(完整版)
Universal Serial Bus 3.0 Specification Hewlett-Packard Company Intel Corporation Microsoft Corporation NEC Corporation ST-NXP Wireless Texas Instruments 1 Introduction ................................................................................................. 1-1 1.1 Motivation .................................................................................................................1-1 1.2 Objective of the Specification ...................................................................................1-2 1.3 Scope of the Document............................................................................................1-2 1.4 USB Product Compliance.........................................................................................1-2 1.5 Document Organization............................................................................................1-3 1.6 Design Goals............................................................................................................1-3 1.7 Related Documents..................................................................................................1-3 2 Terms and Abbreviations ........................................................................... 2-1 3 USB 3.0 Architectural Overview................................................................. 3-1 3.1 USB 3.0 System Description ....................................................................................3-1 3.1.1 USB 3.0 Physical Interface.....................................................................3-2 3.1.1.1 USB 3.0 Mechanical........................................................3-2 3.1.2 USB 3.0 Power .......................................................................................3-3 3.1.3 USB 3.0 System Configuration...............................................................3-3 3.1.4 USB 3.0 Architecture Summary..............................................................3-3 3.2 SuperSpeed Architecture .........................................................................................3-4 3.2.1 Physical Layer ........................................................................................3-5 3.2.2 Link Layer ...............................................................................................3-6 3.2.3 Protocol Layer.........................................................................................3-7 3.2.4 Robustness.............................................................................................3-8 3.2.4.1 Error Detection ................................................................3-8 3.2.4.2 Error Handling .................................................................3-9 3.2.5 SuperSpeed Power Management...........................................................3-9 3.2.6 Devices.................................................................................................3-10 3.2.6.1 Peripheral Devices ........................................................3-10 3.2.6.2 Hubs..............................................................................3-11 3.2.7 Hosts ....................................................................................................3-12 3.2.8 Data Flow Models.................................................................................3-12 4. SuperSpeed Data Flow Model.................................................................... 4-1 4.1 Implementer Viewpoints ...........................................................................................4-1 4.2 SuperSpeed Communication Flow...........................................................................4-1 4.2.1 Pipes.......................................................................................................4-2 4.3 SuperSpeed Protocol Overview ...............................................................................4-2 4.3.1 Differences from USB 2.0.......................................................................4-2 4.3.1.1 Comparing USB 2.0 and SuperSpeed Transactions.......4-3 4.3.1.2 Introduction to SuperSpeed Packets...............................4-4 4.4 Generalized Transfer Description.............................................................................4-4 4.4.1 Data Bursting..........................................................................................4-5 4.4.2 IN Transfers............................................................................................4-5 4.4.3 OUT Transfers........................................................................................4-6 4.4.4 Power Management and Performance...................................................4-7 4.4.5 Control Transfers....................................................................................4-8 4.4.5.1 Control Transfer Packet Size ..........................................4-8 4.4.5.2 Control Transfer Bandwidth Requirements .....................4-8 4.4.5.3 Control Transfer Data Sequences...................................4-9 4.4.6 Bulk Transfers.........................................................................................4-9 4.4.6.1 Bulk Transfer Data Packet Size ......................................4-9 4.4.6.2 Bulk Transfer Bandwidth Requirements........................4-10 4.4.6.3 Bulk Transfer Data Sequences .....................................4-10 4.4.6.4 Bulk Streams.................................................................4-11 4.4.7 Interrupt Transfers ................................................................................4-12 4.4.7.1 Interrupt Transfer Packet Size ......................................4-13 4.4.7.2 Interrupt Transfer Bandwidth Requirements .................4-13 4.4.7.3 Interrupt Transfer Data Sequences...............................4-14 4.4.8 Isochronous Transfers..........................................................................4-14 4.4.8.1 Isochronous Transfer Packet Size ................................4-15 4.4.8.2 Isochronous Transfer Bandwidth Requirements ...........4-15 4.4.8.3 Isochronous Transfer Data Sequences.........................4-16 4.4.9 Device Notifications ..............................................................................4-16 4.4.10 Reliability ..............................................................................................4-16 4.4.10.1 Physical Layer...............................................................4-16 4.4.10.2 Link Layer......................................................................4-16 4.4.10.3 Protocol Layer ...............................................................4-17 4.4.11 Efficiency ..............................................................................................4-17 5 Mechanical ................................................................................................... 5-1 5.1 Objective ..................................................................................................................5-1 5.2 Significant Features..................................................................................................5-1 5.2.1 Connectors .............................................................................................5-1 5.2.1.1 USB 3.0 Standard-A Connector ......................................5-2 5.2.1.2 USB 3.0 Standard-B Connector ......................................5-2 5.2.1.3 USB 3.0 Powered-B Connector ......................................5-2 5.2.1.4 USB 3.0 Micro-B Connector............................................5-2 5.2.1.5 USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors.....5-3 5.2.2 Compliant Cable Assemblies..................................................................5-3 5.2.3 Raw Cables ............................................................................................5-3 5.3 Connector Mating Interfaces ....................................................................................5-4 5.3.1 USB 3.0 Standard-A Connector..............................................................5-4 5.3.1.1 Interface Definition ..........................................................5-4 5.3.1.2 Pin Assignments and Description .................................5-14 5.3.1.3 USB 3.0 Standard-A Connector Color Coding ..............5-14 5.3.2 USB 3.0 Standard-B Connector............................................................5-15 5.3.2.1 Interface Definition ........................................................5-15 5.3.2.2 Pin Assignments and Description .................................5-20 5.3.3 USB 3.0 Powered-B Connector............................................................5-20 5.3.3.1 Interface Definition ........................................................5-20 5.3.3.2 Pin Assignments and Descriptions................................5-25 5.3.4 USB 3.0 Micro Connector Family .........................................................5-25 5.3.4.1 Interfaces Definition ......................................................5-25 5.3.4.2 Pin Assignments and Description .................................5-33 5.4 Cable Construction and Wire Assignments............................................................5-35 5.4.1 Cable Construction ...............................................................................5-35 5.4.2 Wire Assignments.................................................................................5-36 5.4.3 Wire Gauges and Cable Diameters ......................................................5-36 5.5 Cable Assemblies...................................................................................................5-37 5.5.1 USB 3.0 Standard-A to USB 3.0 Standard-B Cable Assembly.............5-37 5.5.2 USB 3.0 Standard-A to USB 3.0 Standard-A Cable Assembly.............5-38 5.5.3 USB 3.0 Standard-A to USB 3.0 Micro-B Cable Assembly ..................5-39 5.5.4 USB 3.0 Micro-A to USB 3.0 Micro-B Cable Assembly ........................5-41 5.5.5 USB 3.0 Micro-A to USB 3.0 Standard-B Cable Assembly ..................5-43 5.5.6 USB 3.0 Icon Location..........................................................................5-44 5.5.7 Cable Assembly Length........................................................................5-45 5.6 Electrical Requirements .........................................................................................5-46 5.6.1 SuperSpeed Electrical Requirements...................................................5-46 5.6.1.1 Raw Cable.....................................................................5-46 5.6.1.1.1 Characteristic Impedance.........................................5-46 5.6.1.1.2 Intra-Pair Skew.........................................................5-46 5.6.1.1.3 Differential Insertion Loss.........................................5-47 5.6.1.2 Mated Connector...........................................................5-47 5.6.1.3 Mated Cable Assemblies ..............................................5-48 5.6.1.3.1 Differential Insertion Loss (EIA-360-101) .................5-49 5.6.1.3.2 Differential Near-End Crosstalk between SuperSpeed Pairs (EIA-360-90)........................5-50 5.6.1.3.3 Differential Crosstalk between D+/D- and SuperSpeed Pairs (EIA-360-90)........................5-51 5.6.1.3.4 Differential-to-Common-Mode Conversion...............5-52 5.6.2 DC Electrical Requirements..................................................................5-52 5.6.2.1 Low Level Contact Resistance (EIA 364-23B) ..............5-52 5.6.2.2 Dielectric Strength (EIA 364-20) ...................................5-52 5.6.2.3 Insulation Resistance (EIA 364-21)...............................5-53 5.6.2.4 Contact Current Rating (EIA 364-70, Method 2) ...........5-53 5.7 Mechanical and Environmental Requirements.......................................................5-53 5.7.1 Mechanical Requirements ....................................................................5-53 5.7.1.1 Insertion Force (EIA 364-13).........................................5-53 5.7.1.2 Extraction Force (EIA 364-13).......................................5-53 5.7.1.3 Durability or Insertion/Extraction Cycles (EIA 364-09) ..5-53 5.7.1.4 Cable Flexing (EIA 364-41, Condition I)........................5-54 5.7.1.5 Cable Pull-Out (EIA 364-38, Condition A).....................5-54 5.7.1.6 Peel Strength (USB 3.0 Micro Connector Family Only) ..................................................................5-54 5.7.1.7 4-Axes Continuity Test (USB 3.0 Micro Connector Family Only) ..................................................................5-54 5.7.1.8 Wrenching Strength (Reference, USB 3.0 Micro Connector Family Only) ................................................5-56 5.7.1.9 Lead Co-Planarity .........................................................5-56 5.7.1.10 Solderability...................................................................5-56 5.7.1.11 Restriction of Hazardous Substances (RoHS) Compliance ...................................................................5-56 5.7.2 Environmental Requirements ...............................................................5-56 5.7.3 Materials ...............................................................................................5-57 5.8 Implementation Notes and Design Guides.............................................................5-57 5.8.1 Mated Connector Dimensions ..............................................................5-57 5.8.2 EMI Management .................................................................................5-60 5.8.3 Stacked Connectors .............................................................................5-60 6 Physical Layer ............................................................................................. 6-1 6.1 Physical Layer Overview ..........................................................................................6-1 6.2 Physical Layer Functions .........................................................................................6-1 6.2.1 Measurement Overview..........................................................................6-4 6.2.2 Channel Overview ..................................................................................6-5 6.3 Symbol Encoding .....................................................................................................6-5 6.3.1 Serialization and Deserialization of Data................................................6-6 6.3.2 Normative 8b/10b Decode Rules............................................................6-6 6.3.3 Data Scrambling .....................................................................................6-6 6.3.4 8b/10b Decode Errors.............................................................................6-7 6.3.5 Special Symbols for Framing and Link Management .............................6-8 6.4 Link Initialization and Training ..................................................................................6-8 6.4.1 Normative Training Sequence Rules......................................................6-9 6.4.1.1 Training Control Bits........................................................6-9 6.4.1.2 Training Sequence Values ..............................................6-9 6.4.2 Lane Polarity Inversion .........................................................................6-11 6.4.3 Elasticity Buffer and SKP Ordered Set .................................................6-11 6.4.4 Compliance Pattern ..............................................................................6-12 6.5 Clock and Jitter.......................................................................................................6-13 6.5.1 Informative Jitter Budgeting ..................................................................6-13 6.5.2 Normative Clock Recovery Function ....................................................6-14 6.5.3 Normative Spread Spectrum Clocking (SSC).......................................6-16 6.5.4 Normative Slew Rate Limit ...................................................................6-16 6.6 Signaling.................................................................................................................6-17 6.6.1 Eye Diagrams .......................................................................................6-17 6.6.2 Voltage Level Definitions ......................................................................6-18 6.6.3 Tx and Rx Input Parasitics....................................................................6-19 6.7 Transmitter Specifications ......................................................................................6-20 6.7.1 Transmitter Electrical Parameters ........................................................6-20 6.7.2 Low Power Transmitter.........................................................................6-21 6.7.3 Transmitter Eye ....................................................................................6-22 6.7.4 Tx Compliance Reference Receiver Equalize Function .......................6-22 6.7.5 Informative Transmitter De-emphasis...................................................6-23 6.7.6 Entry into Electrical Idle, U1..................................................................6-23 6.8 Receiver Specifications ..........................................................................................6-24 6.8.1 Receiver Equalization Training.............................................................6-24 6.8.2 Informative Receiver CTLE Function....................................................6-24 6.8.3 Receiver Electrical Parameters ............................................................6-26 6.8.4 Receiver Loopback...............................................................................6-27 6.8.4.1 Loopback BERT............................................................6-27 6.8.5 Normative Receiver Tolerance Compliance Test .................................6-29 6.9 Low Frequency Periodic Signaling (LFPS).............................................................6-30 6.9.1 LFPS Signal Definition..........................................................................6-30 
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u*** 3.0标准规范下载 -(完整版)
Universal Serial Bus 3.0 Specification Hewlett-Packard Company Intel Corporation Microsoft Corporation NEC Corporation ST-NXP Wireless Texas Instruments 1 Introduction ................................................................................................. 1-1 1.1 Motivation .................................................................................................................1-1 1.2 Objective of the Specification ...................................................................................1-2 1.3 Scope of the Document............................................................................................1-2 1.4 USB Product Compliance.........................................................................................1-2 1.5 Document Organization............................................................................................1-3 1.6 Design Goals............................................................................................................1-3 1.7 Related Documents..................................................................................................1-3 2 Terms and Abbreviations ........................................................................... 2-1 3 USB 3.0 Architectural Overview................................................................. 3-1 3.1 USB 3.0 System Description ....................................................................................3-1 3.1.1 USB 3.0 Physical Interface.....................................................................3-2 3.1.1.1 USB 3.0 Mechanical........................................................3-2 3.1.2 USB 3.0 Power .......................................................................................3-3 3.1.3 USB 3.0 System Configuration...............................................................3-3 3.1.4 USB 3.0 Architecture Summary..............................................................3-3 3.2 SuperSpeed Architecture .........................................................................................3-4 3.2.1 Physical Layer ........................................................................................3-5 3.2.2 Link Layer ...............................................................................................3-6 3.2.3 Protocol Layer.........................................................................................3-7 3.2.4 Robustness.............................................................................................3-8 3.2.4.1 Error Detection ................................................................3-8 3.2.4.2 Error Handling .................................................................3-9 3.2.5 SuperSpeed Power Management...........................................................3-9 3.2.6 Devices.................................................................................................3-10 3.2.6.1 Peripheral Devices ........................................................3-10 3.2.6.2 Hubs..............................................................................3-11 3.2.7 Hosts ....................................................................................................3-12 3.2.8 Data Flow Models.................................................................................3-12 4. SuperSpeed Data Flow Model.................................................................... 4-1 4.1 Implementer Viewpoints ...........................................................................................4-1 4.2 SuperSpeed Communication Flow...........................................................................4-1 4.2.1 Pipes.......................................................................................................4-2 4.3 SuperSpeed Protocol Overview ...............................................................................4-2 4.3.1 Differences from USB 2.0.......................................................................4-2 4.3.1.1 Comparing USB 2.0 and SuperSpeed Transactions.......4-3 4.3.1.2 Introduction to SuperSpeed Packets...............................4-4 4.4 Generalized Transfer Description.............................................................................4-4 4.4.1 Data Bursting..........................................................................................4-5 4.4.2 IN Transfers............................................................................................4-5 4.4.3 OUT Transfers........................................................................................4-6 4.4.4 Power Management and Performance...................................................4-7 4.4.5 Control Transfers....................................................................................4-8 4.4.5.1 Control Transfer Packet Size ..........................................4-8 4.4.5.2 Control Transfer Bandwidth Requirements .....................4-8 4.4.5.3 Control Transfer Data Sequences...................................4-9 4.4.6 Bulk Transfers.........................................................................................4-9 4.4.6.1 Bulk Transfer Data Packet Size ......................................4-9 4.4.6.2 Bulk Transfer Bandwidth Requirements........................4-10 4.4.6.3 Bulk Transfer Data Sequences .....................................4-10 4.4.6.4 Bulk Streams.................................................................4-11 4.4.7 Interrupt Transfers ................................................................................4-12 4.4.7.1 Interrupt Transfer Packet Size ......................................4-13 4.4.7.2 Interrupt Transfer Bandwidth Requirements .................4-13 4.4.7.3 Interrupt Transfer Data Sequences...............................4-14 4.4.8 Isochronous Transfers..........................................................................4-14 4.4.8.1 Isochronous Transfer Packet Size ................................4-15 4.4.8.2 Isochronous Transfer Bandwidth Requirements ...........4-15 4.4.8.3 Isochronous Transfer Data Sequences.........................4-16 4.4.9 Device Notifications ..............................................................................4-16 4.4.10 Reliability ..............................................................................................4-16 4.4.10.1 Physical Layer...............................................................4-16 4.4.10.2 Link Layer......................................................................4-16 4.4.10.3 Protocol Layer ...............................................................4-17 4.4.11 Efficiency ..............................................................................................4-17 5 Mechanical ................................................................................................... 5-1 5.1 Objective ..................................................................................................................5-1 5.2 Significant Features..................................................................................................5-1 5.2.1 Connectors .............................................................................................5-1 5.2.1.1 USB 3.0 Standard-A Connector ......................................5-2 5.2.1.2 USB 3.0 Standard-B Connector ......................................5-2 5.2.1.3 USB 3.0 Powered-B Connector ......................................5-2 5.2.1.4 USB 3.0 Micro-B Connector............................................5-2 5.2.1.5 USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors.....5-3 5.2.2 Compliant Cable Assemblies..................................................................5-3 5.2.3 Raw Cables ............................................................................................5-3 5.3 Connector Mating Interfaces ....................................................................................5-4 5.3.1 USB 3.0 Standard-A Connector..............................................................5-4 5.3.1.1 Interface Definition ..........................................................5-4 5.3.1.2 Pin Assignments and Description .................................5-14 5.3.1.3 USB 3.0 Standard-A Connector Color Coding ..............5-14 5.3.2 USB 3.0 Standard-B Connector............................................................5-15 5.3.2.1 Interface Definition ........................................................5-15 5.3.2.2 Pin Assignments and Description .................................5-20 5.3.3 USB 3.0 Powered-B Connector............................................................5-20 5.3.3.1 Interface Definition ........................................................5-20 5.3.3.2 Pin Assignments and Descriptions................................5-25 5.3.4 USB 3.0 Micro Connector Family .........................................................5-25 5.3.4.1 Interfaces Definition ......................................................5-25 5.3.4.2 Pin Assignments and Description .................................5-33 5.4 Cable Construction and Wire Assignments............................................................5-35 5.4.1 Cable Construction ...............................................................................5-35 5.4.2 Wire Assignments.................................................................................5-36 5.4.3 Wire Gauges and Cable Diameters ......................................................5-36 5.5 Cable Assemblies...................................................................................................5-37 5.5.1 USB 3.0 Standard-A to USB 3.0 Standard-B Cable Assembly.............5-37 5.5.2 USB 3.0 Standard-A to USB 3.0 Standard-A Cable Assembly.............5-38 5.5.3 USB 3.0 Standard-A to USB 3.0 Micro-B Cable Assembly ..................5-39 5.5.4 USB 3.0 Micro-A to USB 3.0 Micro-B Cable Assembly ........................5-41 5.5.5 USB 3.0 Micro-A to USB 3.0 Standard-B Cable Assembly ..................5-43 5.5.6 USB 3.0 Icon Location..........................................................................5-44 5.5.7 Cable Assembly Length........................................................................5-45 5.6 Electrical Requirements .........................................................................................5-46 5.6.1 SuperSpeed Electrical Requirements...................................................5-46 5.6.1.1 Raw Cable.....................................................................5-46 5.6.1.1.1 Characteristic Impedance.........................................5-46 5.6.1.1.2 Intra-Pair Skew.........................................................5-46 5.6.1.1.3 Differential Insertion Loss.........................................5-47 5.6.1.2 Mated Connector...........................................................5-47 5.6.1.3 Mated Cable Assemblies ..............................................5-48 5.6.1.3.1 Differential Insertion Loss (EIA-360-101) .................5-49 5.6.1.3.2 Differential Near-End Crosstalk between SuperSpeed Pairs (EIA-360-90)........................5-50 5.6.1.3.3 Differential Crosstalk between D+/D- and SuperSpeed Pairs (EIA-360-90)........................5-51 5.6.1.3.4 Differential-to-Common-Mode Conversion...............5-52 5.6.2 DC Electrical Requirements..................................................................5-52 5.6.2.1 Low Level Contact Resistance (EIA 364-23B) ..............5-52 5.6.2.2 Dielectric Strength (EIA 364-20) ...................................5-52 5.6.2.3 Insulation Resistance (EIA 364-21)...............................5-53 5.6.2.4 Contact Current Rating (EIA 364-70, Method 2) ...........5-53 5.7 Mechanical and Environmental Requirements.......................................................5-53 5.7.1 Mechanical Requirements ....................................................................5-53 5.7.1.1 Insertion Force (EIA 364-13).........................................5-53 5.7.1.2 Extraction Force (EIA 364-13).......................................5-53 5.7.1.3 Durability or Insertion/Extraction Cycles (EIA 364-09) ..5-53 5.7.1.4 Cable Flexing (EIA 364-41, Condition I)........................5-54 5.7.1.5 Cable Pull-Out (EIA 364-38, Condition A).....................5-54 5.7.1.6 Peel Strength (USB 3.0 Micro Connector Family Only) ..................................................................5-54 5.7.1.7 4-Axes Continuity Test (USB 3.0 Micro Connector Family Only) ..................................................................5-54 5.7.1.8 Wrenching Strength (Reference, USB 3.0 Micro Connector Family Only) ................................................5-56 5.7.1.9 Lead Co-Planarity .........................................................5-56 5.7.1.10 Solderability...................................................................5-56 5.7.1.11 Restriction of Hazardous Substances (RoHS) Compliance ...................................................................5-56 5.7.2 Environmental Requirements ...............................................................5-56 5.7.3 Materials ...............................................................................................5-57 5.8 Implementation Notes and Design Guides.............................................................5-57 5.8.1 Mated Connector Dimensions ..............................................................5-57 |
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