请问高温环境下的FPGA哪种速度等级更合适？

在Austin Lesea获得机会之前，我会对此采取行动...... :)
通常（从数据表中）最大规格
工作温度低于结温。
比如..
对应的结，最高工作温度可以是105℃
温度为125℃。
但Xilinx的数据表仅提到工作温度为最大结温。
为什么是这样 ？
重要的考虑因素是结温。
操作（环境空气）温度对模具温度的影响程度很大程度上取决于
正在使用的FPGA封装
FPGA设计消耗了多少功率
这两者都是变量很大（至少可以说！）。
因此，简单的“工作温度”额定值对FPGA设计人员没有用。
考虑：
FPGA消耗功率。
这种功率加热了芯片。
芯片通过FPGA封装“泄漏”热量。
FPGA封装将“热量”泄漏到电路板和环境空气中。
你如何计算模具温度？
尝试这个：
Tj = Ta + [Power x [Theta J-C + Theta C-A]]
Tj =结温（℃）
Ta =环境空气温度（℃）
功耗= FPGA功耗（瓦特）
Theta J-C =封装热阻抗（deg C / W）
Theta C-A =封装到环境热阻抗（deg C / W）
Xilinx提供theta J-C的规格，并提供theta C-A的规格。
请注意，θC-A取决于封装类型，封装上的气流（如果有的话），散热（如果有的话）和电路板结构。
通过封装引脚到电路板（以及从电路板到环境空气）发生显着的热“泄漏”，特别是如果电路板具有用作热辐射器的电源和接地平面。
- 鲍勃埃尔金德
签名：新手的自述文件在这里：http：//forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结：1。
阅读手册或用户指南。
你读过手册了吗？
你能找到手册吗？2。
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在原帖中查看解决方案



以下为原文

I'll take a crack at this before Austin Lesea gets his chance...  :)

Usually ( as from the datasheet) the specification for  maximum operating temperature is lower than junction temperature. For e.g..  maximum operating temperature can be 105C for a corresponding junction temperature of 125C. 
But Xilinx's datasheet only mentions operating temperature as Max Junction temperature. Why is this ?

The important consideration is junction temperature.  The extent to which operating (ambient air) temperature affects die temperature is heavily determined by

• the FPGA package being used
  
• how much power is consumed by the FPGA design
  

both of which are wide variable (to say the least!).  So a simple "operating temperature" rating is not useful for FPGA designers.
 
Consider:

• The FPGA consumes power.
  
• This power heats the die.
  
• The die "leaks" heat through the FPGA package.
  
• The FPGA package "leaks" heat to the circuit board and to ambient air.
  

How do you calculate die temperature?  Try this:
 
Tj = Ta + [ Power x [ Theta J-C  +  Theta C-A ] ]

Tj        = Junction temperature (deg C)

Ta        = Ambient air temperature (deg C)

Power     = FPGA power consumption (Watts)
Theta J-C = die to package thermal impedance (deg C per Watt)

Theta C-A = package to ambient thermal impedance (deg C per Watt)

Xilinx provides specs for theta J-C, and provides specs for theta C-A.
 
Note that theta C-A depends on package type, air flow across the package (if any), heat sinking (if any), and circuit board construction.  Significant heat "leakage" occurs through the package pins to the circuit board (and from the circuit board to ambient air), especially if the circuit board has power and ground planes which act as thermal radiators.
 
-- Bob Elkind
SIGNATURE:
README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369

Summary:
1. Read the manual or user guide.  Have you read the manual? Can you find the manual?
2. Search the forums (and search the web) for similar topics.
3. Do not post the same question on multiple forums.
4. Do not post a new topic or question on someone else's thread, start a new thread!
5. Students: Copying code is not the same as learning to design.
6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please).
7. You are not charged extra fees for comments in your code.
8. I am not paid for forum posts.  If I write a good post, then I have been good for nothing.View solution in original post

>但Xilinx的数据表仅提到工作温度为最大结温。
为什么是这样 ？
Xilinx FPGA广泛应用于功耗和环境不同的应用中。
这些器件具有结温范围，符合数据手册规范，设计人员可根据具体的应用功耗和热环境确保满足该范围。
>如果速度不是标准，您对高温环境建议哪种速度等级？
Xilinx汽车Q级可提供Tj高达125C的器件
http://www.xilinx.com/products/xas6/index.htm
------您是否尝试在Google中输入问题？
如果没有，你应该在发布之前。太多结果？
尝试添加网站：www.xilinx.com



以下为原文

> But Xilinx's datasheet only mentions operating temperature as Max Junction temperature. Why is this ?
 
Xilinx FPGAs are used in a wide variety of applications with very different power consumption and ambient environments.  The devices are specified to operate to the data sheet specs with a junction temperature range and it is up to the designer to ensure that this range can be met based on their specific application  power consumption and thermal environment.
 
>Which speed grade do you suggest for high temperature environment if speed is not a criteria ?

Device with a Tj up to 125C are available in the Xilinx Automotive Q-grade
http://www.xilinx.com/products/xas6/index.htm
------Have you tried typing your question into Google?  If not you should before posting.
Too many results?  Try adding site:www.xilinx.com

在Austin Lesea获得机会之前，我会对此采取行动...... :)
通常（从数据表中）最大规格
工作温度低于结温。
比如..
对应的结，最高工作温度可以是105℃
温度为125℃。
但Xilinx的数据表仅提到工作温度为最大结温。
为什么是这样 ？
重要的考虑因素是结温。
操作（环境空气）温度对模具温度的影响程度很大程度上取决于
正在使用的FPGA封装
FPGA设计消耗了多少功率
这两者都是变量很大（至少可以说！）。
因此，简单的“工作温度”额定值对FPGA设计人员没有用。
考虑：
FPGA消耗功率。
这种功率加热了芯片。
芯片通过FPGA封装“泄漏”热量。
FPGA封装将“热量”泄漏到电路板和环境空气中。
你如何计算模具温度？
尝试这个：
Tj = Ta + [Power x [Theta J-C + Theta C-A]]
Tj =结温（℃）
Ta =环境空气温度（℃）
功耗= FPGA功耗（瓦特）
Theta J-C =封装热阻抗（deg C / W）
Theta C-A =封装到环境热阻抗（deg C / W）
Xilinx提供theta J-C的规格，并提供theta C-A的规格。
请注意，θC-A取决于封装类型，封装上的气流（如果有的话），散热（如果有的话）和电路板结构。
通过封装引脚到电路板（以及从电路板到环境空气）发生显着的热“泄漏”，特别是如果电路板具有用作热辐射器的电源和接地平面。
- 鲍勃埃尔金德
签名：新手的自述文件在这里：http：//forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结：1。
阅读手册或用户指南。
你读过手册了吗？
你能找到手册吗？2。
搜索论坛（并搜索网页）以寻找类似的主题。
不要在多个论坛上发布相同的问题。
不要在别人的主题上发布新主题或问题，开始新的主题！5。
学生：复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。
提供有用的详细信息（请与网页，数据表链接）.7。
您的代码中的评论不需要支付额外费用。
我没有支付论坛帖子的费用。
如果我写一篇好文章，那么我一无所获。



以下为原文

I'll take a crack at this before Austin Lesea gets his chance...  :)

Usually ( as from the datasheet) the specification for  maximum operating temperature is lower than junction temperature. For e.g..  maximum operating temperature can be 105C for a corresponding junction temperature of 125C. 
But Xilinx's datasheet only mentions operating temperature as Max Junction temperature. Why is this ?

The important consideration is junction temperature.  The extent to which operating (ambient air) temperature affects die temperature is heavily determined by

• the FPGA package being used
  
• how much power is consumed by the FPGA design
  

both of which are wide variable (to say the least!).  So a simple "operating temperature" rating is not useful for FPGA designers.
 
Consider:

• The FPGA consumes power.
  
• This power heats the die.
  
• The die "leaks" heat through the FPGA package.
  
• The FPGA package "leaks" heat to the circuit board and to ambient air.
  

How do you calculate die temperature?  Try this:
 
Tj = Ta + [ Power x [ Theta J-C  +  Theta C-A ] ]

Tj        = Junction temperature (deg C)

Ta        = Ambient air temperature (deg C)

Power     = FPGA power consumption (Watts)
Theta J-C = die to package thermal impedance (deg C per Watt)

Theta C-A = package to ambient thermal impedance (deg C per Watt)

Xilinx provides specs for theta J-C, and provides specs for theta C-A.
 
Note that theta C-A depends on package type, air flow across the package (if any), heat sinking (if any), and circuit board construction.  Significant heat "leakage" occurs through the package pins to the circuit board (and from the circuit board to ambient air), especially if the circuit board has power and ground planes which act as thermal radiators.
 
-- Bob Elkind
SIGNATURE:
README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369

Summary:
1. Read the manual or user guide.  Have you read the manual? Can you find the manual?
2. Search the forums (and search the web) for similar topics.
3. Do not post the same question on multiple forums.
4. Do not post a new topic or question on someone else's thread, start a new thread!
5. Students: Copying code is not the same as learning to design.
6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please).
7. You are not charged extra fees for comments in your code.
8. I am not paid for forum posts.  If I write a good post, then I have been good for nothing.

据我所知，Spartan-6 FPGA的温度范围可达125℃
汽车FPGA XALX45-Q有两种速度等级-3和-2。
速度等级与FPGA的运行速度有关，据我所知，它与FPGA的制造过程有关。
由于同一系列FPGA的不同速度等级的制造处理不同，我期望（???）具有不同速度等级的FPGA的热特性有一些差异。
我的问题是哪种速度等级更适合高温环境。
萨曼斯



以下为原文

I understand Spartan-6 FPGA comes with extended temperature upto 125C
Automotive FPGA  XALX45-Q comes in two speed grades -3 and -2.
 
Speed grade relates to the how fast FPGA can run and as far as I know it is related to manufacturing process of FPGA.
 
Since the manufacturing processing is different for different speed grades of same series of FPGA, I expect (???) some difference in thermal properties in FPGAs with different speed grades.
 
My question is which speed grade is better for high temperature environment.?
 
Sumanth

>我的问题是哪种速度等级更适合高温环境。
您可以选择允许设计中的时间正常运行的速度等级。
您可以选择支持应用和热环境所需的结温的温度等级。
------您是否尝试在Google中输入问题？
如果没有，你应该在发布之前。太多结果？
尝试添加网站：www.xilinx.com



以下为原文

> My question is which speed grade is better for high temperature environment.?
 
You select the speed grade that allows the timing in your design to function correctly.
You select the temperature grade that supports the junction temperatures required for your application and thermal environment.
------Have you tried typing your question into Google?  If not you should before posting.
Too many results?  Try adding site:www.xilinx.com

速度等级与FPGA的运行速度有关
严格来说，没有。
速度等级涉及在生产线上运行和传递的速度测试屏幕。
据我所知，这与FPGA的制造过程有关。
可能不会。
所有Spartan-6晶圆都可能“相同”地处理，具有正常的CMOS工艺变化和公差。
这是我根据行业经验猜测的，而不是内部知识（我不是Xilinx的员工，从来没有）
由于制造加工对于不同的速度是不同的
同系列FPGA的等级
假设不正确（之前的免责声明适用）
我期待（???）热量的一些差异 
FPGAs中具有不同速度等级的属性
严格来说，没有。
硅晶片的热性能和每个封装设计非常一致。
变化的原因（主要是由于正常的生产线工艺变化）是薄层电阻，器件尺寸和掺杂水平 - 所有这些都会影响有效速度和功耗。
硅中的功耗与“热特性”不同。
我的问题是哪种速度等级更适合高温环境。
对你没有好的答案。
最低功率部件可能处于最慢的速度等级箱中，并且不太可能处于较高速度等级箱中。
但是高速（和高功率）部件也可能处于最慢的速度等级箱中。
顺便问一下，环境工作温度的上限是多少？
请注意，Spartan-6部件不会简单地停止在高于规格的结点温度下工作。
在数据表结温以上运行通常会导致速度降低和使用寿命缩短，速度与工作温度和寿命相对于工作温度的“曲线”不是（必然）直线。
我可能错了，但汽车级零件可能会在低温和高温下进行筛选。
如果您的应用程序不特别关注低温操作范围，则您（至少）有两个额外选项：
请联系Xilinx，了解有关高温的特殊筛选。
购买最低速度（我最好的猜测）部件，并通过第三方服务签订自己的特殊屏幕。
这些只是我的意见，没有明示或暗示的保证。
- 鲍勃埃尔金德
签名：新手的自述文件在这里：http：//forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结：1。
阅读手册或用户指南。
你读过手册了吗？
你能找到手册吗？2。
搜索论坛（并搜索网页）以寻找类似的主题。
不要在多个论坛上发布相同的问题。
不要在别人的主题上发布新主题或问题，开始新的主题！5。
学生：复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。
提供有用的详细信息（请与网页，数据表链接）.7。
您的代码中的评论不需要支付额外费用。
我没有支付论坛帖子的费用。
如果我写一篇好文章，那么我一无所获。



以下为原文

Speed grade relates to the how fast FPGA can run

Strictly speaking, no.  Speed grade relates to which speed test screens have been run and passed on the production line.

and as far as I know it is related to manufacturing process of FPGA.

Probably not.  All Spartan-6 wafers probably processed "identically", with normal CMOS process variations and tolerances.  This is my guess based on industry experience, not inside knowledge (I'm not a Xilinx employee, never have been)

Since the manufacturing processing is different for different speed grades of same series of FPGA

Incorrect assumption (previous disclaimer applies)

I expect (???) some difference in thermal properties in FPGAs with different speed grades

Strictly speaking, no.  Thermal properties of silicon wafers and each package design are pretty consistent.  What will vary (mostly due to normal production line process variations) are sheet resistance, device sizes, and doping levels -- all of which affect effective speeds and power consumption.  Power consumption in the silicon is not the same thing as "thermal properties".

My question is which speed grade is better for high temperature environment.?

No good answer for you.  The lowest power parts are likely to be in the slowest speed grade bin, and are unlikely to be in the higher speed grade bins.  But high-speed (and high-power) parts could also be in the slowest speed grade bin.
 
By the way, what is the upper limit for your ambient operating temperature?
 
Note that the Spartan-6 parts will not simply stop working at junction temps above spec.  Operating above datasheet junction temp will generally result in reduced speed and reduced operating life, and the "curves" of speed vs. operating temp and lifespan vs. operating temp are not (necessarily) straight lines.
 
I may be wrong, but automotive grade parts are probably screened for both low temp and high temp.  If you have an application which doesn't particularly care about low temp operating range, you have (at least) two additional options:

• Contact Xilinx about special screening for high-temp only.
  
• Buy lowest-speed (my best guess) parts and contract your own special screens through 3rd party service.
  

These are just my opinions, no warranty expressed or implied.
 
-- Bob Elkind
SIGNATURE:
README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369

Summary:
1. Read the manual or user guide.  Have you read the manual? Can you find the manual?
2. Search the forums (and search the web) for similar topics.
3. Do not post the same question on multiple forums.
4. Do not post a new topic or question on someone else's thread, start a new thread!
5. Students: Copying code is not the same as learning to design.
6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please).
7. You are not charged extra fees for comments in your code.
8. I am not paid for forum posts.  If I write a good post, then I have been good for nothing.

>我的问题是哪种速度等级更适合高温环境。
您可以选择允许设计中的时间正常运行的速度等级。
您可以选择支持应用和热环境所需的结温的温度等级。
对于Ed的简明回复，我想补充一下：
考虑设计的功耗，所选设备包的热性能以及设备冷却方案（如果有）。
- 鲍勃埃尔金德
签名：新手的自述文件在这里：http：//forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结：1。
阅读手册或用户指南。
你读过手册了吗？
你能找到手册吗？2。
搜索论坛（并搜索网页）以寻找类似的主题。
不要在多个论坛上发布相同的问题。
不要在别人的主题上发布新主题或问题，开始新的主题！5。
学生：复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。
提供有用的详细信息（请与网页，数据表链接）.7。
您的代码中的评论不需要支付额外费用。
我没有支付论坛帖子的费用。
如果我写一篇好文章，那么我一无所获。



以下为原文

> My question is which speed grade is better for high temperature environment.?
You select the speed grade that allows the timing in your design to function correctly.
You select the temperature grade that supports the junction temperatures required for your application and thermal environment.

To Ed's concise response I would add:
Factor in the power consumption of your design, the thermal properties of the device package you select, and your device cooling scheme (if any).
 
-- Bob Elkind
SIGNATURE:
README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369

Summary:
1. Read the manual or user guide.  Have you read the manual? Can you find the manual?
2. Search the forums (and search the web) for similar topics.
3. Do not post the same question on multiple forums.
4. Do not post a new topic or question on someone else's thread, start a new thread!
5. Students: Copying code is not the same as learning to design.
6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please).
7. You are not charged extra fees for comments in your code.
8. I am not paid for forum posts.  If I write a good post, then I have been good for nothing.

我还强烈建议您花一些时间使用XPE电子表格，以便轻松记住http://www.xilinx.com/power
您可以看到诸如对电源的贡献（静态，动态，I / O和收发器），温度对静态功率的影响，典型与最大过程，热计算的自动化，其他有用的概念等。
还有一些非显而易见的事情： - 更新的家族（例如7）可能最大静态功率在不同温度等级之间不再相等 - 即使对于给定的相同85Cjunction温度也有助于解释I等级部件的更广泛可能的环境
。
以及其他内容：
http://www.xilinx.com/support/documentation/white_papers/wp389_Lowering_Power_at_28nm.pdf(利用Xilinx 7系列FPGA降低28 nm的功耗）
干杯，
BT



以下为原文

感谢Bob和Bt提出的宝贵建议。
我们将在最高环境温度下将产品运行至125℃，持续2小时。
这就是为什么我想在评估汽车Q级FPGA的同时获得成功。
有一点我很确定我们的设计不会有任何时序问题Spartan-6 FPGA。
我们灵活地选择2或3级速度。
我想确保速度等级选择有什么不同。
萨曼斯



以下为原文

Thank you Bob and Bt for valuable suggestions.
 
We will be operating our product at Maximum Ambient temperature upto 125C for around 2 hours.
This is why I want to be extra careful while evaluating Automotive Q grade FPGA.
 
One thing I'm pretty sure is our design will not have any timing problem on Spartan-6 FPGA. 
We are flexible in selecting the 2 or 3 speed grades.
 
I  want to make sure whether the speed grade choice makes any difference.
 
Sumanth

我们将在最高环境温度下将产品运行至125℃，持续2小时。
如果FPGA无电源时间足够长，则芯片温度将与环境空气温度相同。
通电后，设备结温将升至环境空气温度以上。
如果环境空气温度为125℃，模具温度将高于125℃ - 除非你有一些冷却（即冷藏）方案。
结温将高于125C的程度在某种程度上取决于您使用的器件，设计的功耗以及器件封装。
在125℃以上的某些温度下，FPGA的某些功能将不再起作用，并且降低速度是升高温度的唯一损失的假设将不再成立。
请记住，漏电流是器件功耗的重要组成部分 - 无论工作频率或栅极使用情况如何。
在进一步研究之前，您应该使用Xilinx功耗估算器（XPE）电子表格来了解您可能需要处理的功耗（和结温）。
有一点我很确定我们的设计不会有任何时序问题Spartan-6 FPGA。
我们灵活地选择2或3级速度。
在某些工作温度点，速度不再是您主要关注的问题。
也许在Xilinx拥有内部知识的人可能会在设备功能受损之前为您提供有关高温范围的指导。
如果此信息可用，您可能需要签署保密协议（保密协议）。
- 鲍勃埃尔金德
签名：新手的自述文件在这里：http：//forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369总结：1。
阅读手册或用户指南。
你读过手册了吗？
你能找到手册吗？2。
搜索论坛（并搜索网页）以寻找类似的主题。
不要在多个论坛上发布相同的问题。
不要在别人的主题上发布新主题或问题，开始新的主题！5。
学生：复制代码与学习设计不同.6“它不起作用”不是一个可以回答的问题。
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如果我写一篇好文章，那么我一无所获。



以下为原文

We will be operating our product at Maximum Ambient temperature upto 125C for around 2 hours.

If the FPGA sits unpowered long enough, the die temperature will be the same as ambient air temperature.  When powered, device junction temperature will rise above ambient air temperature.
 
If ambient air temperature is 125C, die temperature will be operating above 125C -- unless you have some cooling (i.e. refrigeration) scheme.  The extent to which junction temp will be higher than 125C depends somewhat on which device you are using, your design's power consumption, and the device package.
 
At some juction temperature above 125C some functions of the FPGA will no longer function, and the presumption that reduced speed is the only penalty for elevated temperature will no longer hold.  Remember, leakage current is a significant component of device power consumption -- regardless of operating frequency or gate usage.
 
Before you go much further, you should use the Xilinx Power Estimator (XPE) spreadsheet to see just how much power consumption (and junction temp) you might need to handle.

One thing I'm pretty sure is our design will not have any timing problem on Spartan-6 FPGA. 
We are flexible in selecting the 2 or 3 speed grades.

At some operating temperature point, speed is no longer your primary concern.
 
Perhaps someone with inside knowledge at Xilinx may be able to offer you some guidance with respect to elevated temperature range before device function is impaired.  If this information is available, you may need to sign an NDA (confidentiality agreement).
 
-- Bob Elkind
SIGNATURE:
README for newbies is here: http://forums.xilinx.com/t5/New-Users-Forum/README-first-Help-for-new-users/td-p/219369

Summary:
1. Read the manual or user guide.  Have you read the manual? Can you find the manual?
2. Search the forums (and search the web) for similar topics.
3. Do not post the same question on multiple forums.
4. Do not post a new topic or question on someone else's thread, start a new thread!
5. Students: Copying code is not the same as learning to design.
6 "It does not work" is not a question which can be answered. Provide useful details (with webpage, datasheet links, please).
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嗨，
我们正在寻找非常高温的FPGA，可以运行到195'C，
你能不能取悦任何零件编号或产品。
如果您需要我方提供的任何其他信息，请告诉我。
提前致谢
Pooja Tiwari
pooja.tiwari@Quest-global.com



以下为原文

Hi,
we are looking very high temperature FPGA, that can operate till 195'C,
 
can you please any part number or product.
 
if you need any other information from my side please let me know.
 
 
 
Thanks in advance
Pooja Tiwari
pooja.tiwari@Quest-global.com

您好，不知您是否已经获取到195'C的FPGA芯片，如果还有需求，我将很愿意为您提供帮助。我单位有最高可达225'C的FPGA，如有需要请与我联系，邮箱：syj720@163.com