[问答]

可以动量计算基板涡流吗？

问答对人有帮助，内容完整，我也想知道答案 0 我正在设计一个没有金属屏蔽的片上电感，并使用动量来模拟电感。但后来我想知道安捷伦的动量是否能够计算出基板中涡流的影响。我从某人那里听说，因为它是2.5D模拟器，基板中的涡流不被照顾。而且，基板似乎没有啮合。然而，对基板有一个阻力，并且似乎也使用了绿色功能，所以我认为应该给出3D结果。其实我不明白什么是所谓的2.5D模拟。我认为时刻的方法应该真正给出准确的3D结果，因为我曾经在天线模拟中使用它。或者安捷伦的动力是不是基于瞬间的方法还是仅仅是简化版的方法？谢谢！以上来自于谷歌翻译以下为原文 I am designing an on-chip inductor without metal shield and uses momentum to model the inductor. but then I wonder if Agilent momentum is able to calculate the effect of the eddy current in substrate. I heard from someone that because it is 2.5D simulator, the eddy current in the substrate is not taken care of. Also, there seems to be no meshing for the substrate. However, there is a resistance defined for the substrate, and also green function seems to be used, so I think it should be giving a 3D result. Actually I do not understand what is so called 2.5D simulation. I think that the method of moment should really be giving the accurate 3D result, since I also used to be using it in antenna simulation. Or is Agilent momentum not based on the method of moment or only a simplified version of it? Thanks! 0
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答案对人有帮助，有参考价值 0 > {quote：title = dog1写道：} {quote}>我正在设计一个没有金属屏蔽的片上电感，并使用动量来模拟电感。但后来我想知道安捷伦的动量是否能够计算出基板中涡流的影响。是。包括基板涡流。 >我从某人那里听说，因为它是2.5D模拟器，基板中的涡流不被照顾。有些3D解算器营销人员尝试通过这些错误的陈述来推广他们的工具。涡电流包含在Momentum模拟中，Momentum非常适合硅衬底上的导体。 >此外，基板似乎没有啮合。正确。即使衬底不需要啮合，有损衬底中的电流也包括在结果中。实际上，通过将衬底电流包括在格林函数中，无需对基板进行网格划分，这种方法比基板网格更准确（由于有限的网格尺寸，它总是近似的）>然而，有一个阻力定义为基质，也似乎使用绿色功能，所以我认为应该给出3D结果。是。 >其实我不明白什么是所谓的2.5D模拟。限制是导体只能位于模电层（水平）或垂直于通孔。我们不能有任意方向的任意形状。这就是为什么有人称之为“2.5D”或“平面3D”。 >或者安捷伦的动力是不是基于瞬间的方法还是仅仅是简化版的方法？是的，Momentum使用MoM。以上来自于谷歌翻译以下为原文 > {quote:title=dog1 wrote:}{quote} > I am designing an on-chip inductor without metal shield and uses momentum to model the inductor. but then I wonder if Agilent momentum is able to calculate the effect of the eddy current in substrate. Yes. Substrate eddy currents are included. > I heard from someone that because it is 2.5D simulator, the eddy current in the substrate is not taken care of. There are some 3D solver marketing guys who try promote their tools by such wrong statements. Eddy current is included in the Momentum simulations, and Momentum is well suited for conductors over silicon substrate. > Also, there seems to be no meshing for the substrate. Correct. The currents in the lossy substrate are included in the results, even though the substrate doesn't need to be meshed. Actually, by including the substrate currents through the Green's function, with no need for meshing the substrate, this approach is more accurate then meshing the substrate (which is always approximate due to finite mesh size) > However, there is a resistance defined for the substrate, and also green function seems to be used, so I think it should be giving a 3D result. Yes. > Actually I do not understand what is so called 2.5D simulation. The limitation is that conductors can only be on the dieelectric layers (horizontal) or vertical for vias. We can't have arbitrary shapes with arbitrary orientation. That is why some call it "2.5D" or "planar 3D". > Or is Agilent momentum not based on the method of moment or only a simplified version of it? Yes, Momentum uses MoM.

2019-2-20 16:46:56 评论举报李桂荣