国际立法，如欧盟的能源相关产品（ErP）指令正在推动消费者工业部门实施节能技术。
从传统电机向永磁同步（PMSM）或无刷直流（BLDC）替代品的迁移可实现更高的能效。
然而，这些更先进的电动机也具有与它们相关的更大的系统复杂性。
PMSM和BLDC需要更复杂的驱动级，这些驱动级依赖于逆变器的使用。
在电力系统设计中包含逆变器元件具有某些含义。
与通用电机所需的简单三端双向可控硅驱动器相比，逆变器产生更多热量并占用更多的电路板空间。
随着PMSM和BLDC的增加，取代过时的电机类型，填充PCB的逆变器数量将增加。
这为功率半导体制造商带来了严峻的挑战。
与基板技术相关的一系列创新使安森美半导体能够将新一代高密度智能功率模块（IPM）推向市场。
由于采用精细间距技术实现高布线密度的直接键合铜（DBC）基板，改善了热性能，这些紧凑型IPM远小于具有相同电流和电压额定值的竞争产品。
它们也表现出降低的功率损耗。
要了解有关安森美半导体在电源技术方面的专业知识的更多信息，您可以访问我们的展位（9号馆，353号）或参加公司代表将在PCIM Europe（5月10日至12日，德国纽伦堡）举办的一系列演讲。
5月10日星期二
海报对话会议下午3:30 - 下午5:30
智能功率模块
PP013改善15A / 600V智能功率模块的系统级功率密度Jonathan Harper，安森美半导体Toshiyuki Iimura，安森美半导体
包装和可靠性
PP045功率器件测试的恢复拓扑结构Tomas Krecek，安森美半导体，CZ
传感器，控制和保护
PP058通过自动死区调谐实现半桥LC转换器的效率最大化Vittorio Crisafulli，安森美半导体Gianluca Fazio，安森美半导体意大利DiegoHernandezGutiérrez，CH
2016年5月11日星期三
海报对话会议下午3:30 - 下午5:30
SiC和GaN
PP099对共源共栅和独立晶体管中650V高压GaN技术的深刻评价Jaume Roig，德国Gomez，Frederick Declercq，Filip Bauwens，安森美半导体Manuel Fernandez，Diego Gonzalez，奥维耶多大学，ES
DC / DC转换器II
PP140现代快速开关MOSFET在VRM中的应用优势和劣势Zhiyang Chen，Ann Starks，安森美半导体
AC-AC和多电平转换器
PP154：住宅和工业感应烹饪趋势：高效率的拓扑和功率器件Vittorio Crisafulli，安森美半导体
参展商论坛7号展厅260号展位
•用于开关应用的高级功率MOSFET Christopher Rexer，安森美半导体
行业论坛6号展厅248号展位
15:30 - 16:00功率集成模块的应用级测试Jonathan Harper，安森美半导体
以上来自于谷歌翻译
以下为原文
International legislation, such as the European Union’s Energy-Related Products (ErP) directive is driving the implementation of energy-saving techniques in both consumer industrial sectors. The migration from conventional motors to permanent magnet synchronous (PMSM) or brushless direct current (BLDC) alternatives is enabling higher degrees of energy efficiency. However, these more advanced motors also have greater system complexity associated with them. PMSMs and BLDCs will need more complex drive stages that rely on utilization of inverters.
Inclusion of an inverter element in the power system design has certain implications. Inverters generate more heat and take up markedly more board real estate than the simple triac drives needed for universal motors. As the uptake of PMSMs and BLDCs increases, supplanting outdated motor types, the number of inverters populating PCBs will increase. This is presenting power semiconductor manufacturers with a serious challenge.
A series of innovations in relation to substrate technology have enabled ON Semiconductor to bring a new generation of high density intelligent power modules (IPMs) to market. Thanks to improved thermal performance, which is derived from direct bonded copper (DBC) substrates using fine pitch technology for high routing density, these compact IPMs are substantially smaller than competing products with equivalent current and voltage ratings. They exhibit reduced power losses too.
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To learn more about ON Semiconductor’s expertise in Power Technology you can visit us at booth (Hall 9, Both 353) or attend a series of presentations that company representatives will be giving at PCIM Europe (10th - 12th May, Nuremburg, Germany).
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Tuesday, May 10
Poster Dialogue Session 3:30 pm – 5:30 pm
- Intelligent Power Modules
- PP013 Improvement of System Level Power Density of 15A/600V Intelligent Power Modules
Jonathan Harper, ON Semiconductor
Toshiyuki Iimura, ON Semiconductor
- Packaging and Reliability
- PP045 A Recuperation Topology for Power Device Testing
Tomas Krecek, ON Semiconductor, CZ
- Sensor, Control and Protection
- PP058 Efficiency Maximization for Half-Bridge LC Converter through Automatic Dead Time Tuning
Vittorio Crisafulli, ON Semiconductor
Gianluca Fazio, ON Semiconductor Italy
Diego Hernandez Gutiérrez, CH
Wednesday, 11 May 2016
Poster Dialogue Session 3:30 pm – 5:30 pm
- SiC and GaN
- PP099 An Insightful Evaluation of a 650V High-Voltage GaN Technology in Cascode and Stand-Alone Transistors
Jaume Roig, German Gomez, Frederick Declercq, Filip Bauwens, ON Semiconductor
Manuel Fernandez, Diego Gonzalez, University of Oviedo, ES
- DC/DC Converter II
- PP140 Application Advantages and Disadvantages of Modern Fast Switching MOSFETs in VRM
Zhiyang Chen, Ann Starks, ON Semiconductor
- AC-AC and Multilevel Converters
- PP154: Trends in Residential and Industrial Induction Cooking: Topologies and Power Devices for High Efficiency
Vittorio Crisafulli, ON Semiconductor
Exhibitor Forum Hall 7 Booth 260
• Advanced Power MOSFET for Switching Applications
Christopher Rexer, ON Semiconductor
Industry Forum Hall 6 Booth 248
- 15:30 – 16:00 Application Level Testing for Power Integrated Modules
Jonathan Harper, ON Semiconductor
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