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嗨,Joel博士,我目前正在考虑从我的DUT中去嵌入我的PCB。
我的DUT包括SMP发射+ PCB走线+封装+ IP。 SMP发射用于测量我们的DUT上的发射器的电气参数(上升时间,抖动等)。 我的PCB由SMP发射+ PCB走线组成。 基本上我想将我的参考平面从SMP移回到包*****,因为这是许多标准(PCIe等)要求参考电气测量的地方。 为了做到这一点,我通常在同一面板中的另一张卡上设计一个副本通道,具有相同的跟踪方向等,这与我的DUT通道相同(尽可能),除了我必须在我的DUT bga是另外的SMP启动时 为了使用VNA进行测量而定位。 然后我使用这些s参数并使用这些去嵌入我的电测量。 但是,我有这个额外的SMP发布,它正在被去嵌入,所以由于额外的SMP发布我有测量错误。 我正在做的是拥有一个复制通道卡,它基本上是两个PCB结构(SMP发射+ PCB走线+ bga + pcb走线+ SMP)。 我的想法是,我假设这个新结构只是我的两个目标结构,我可以使用去嵌入技术提取复合结构的参数将测量这个结构并使用T矩阵,我将能够确定更好的估计 通过后处理该测量来获得SMP发射+ PCB迹线+ bga)。 我目前在我们的实验室中使用N5225A进行这些测量我的问题是1)有没有办法使用N5225A直接进行这种测量1)我可以设置一些东西,如果这是一个已尝试的方法或是否有 你可以推荐更好的方法吗? 我已经包含了一个pdf的测量值和相关的s参数以及端口问候,盖伊 以上来自于谷歌翻译 以下为原文 Hi Dr Joel, I currently looking at de-embedding my PCB from my DUT. My DUT consists of an SMP launch + PCB traces + package + IP. The SMP launch is used to measure electrical parameters of our transmitter on our DUT (risetime, jitter etc). My PCB consists of SMP launch + PCB traces. Basically i want to move my reference plane back from the SMP to the package ***** as this is where many standards (PCIe etc) require the electrical measurements to be referenced. To do this currently I usually design a replica channel on another card in the same panel with the same trace orientation etc. which is identical to my DUT channel (as possible) except that i have to place an additional SMP launch where my DUT bga is located in order to do the measurements using the VNA. I then use these s-parameters and de-embed my electrical measurements using these. However, I have this additional SMP launch which is being de-embedded and so I have measurement errors due to the additional SMP launch. What I am looking at doing is having a replica channel card which is basically two of PCB structures (SMP launch + PCB traces + bga + pcb traces + SMP). The idea is that I assume that this new structure is simply two of my target structures and I can extract the sparameters of the compound structure using de-embedding techniques will measure this structure and using T matrices, i will be able to determine a better estimation of the channel by post processing this measurement to obtain the SMP launch + PCB traces + bga). I currently use the N5225A in our lab to do these measurements My questions are 1) is there any way to use the N5225A to do this measurement directly 1) can i set something is if this is a method that has been tried or is there a better method that you can recommend? I have included a pdf of the measurements and the associated s-parameters with ports Regards, Guy 附件
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2个回答
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对不起,请注意我发送的原始邮件的以下更正。
第二个问题应该是2)已经尝试过这种方法还是有更好的方法可以推荐? 注意:使用这种方法我仍然需要构建一个副本卡,但它可能更准确地表示我现在正在做的事情(在跟踪的两端都有SMP)。 以上来自于谷歌翻译 以下为原文 Sorry, please note the following correction on the original message that I sent. the second question should read 2) has this method been tried or is there a better method that you can recommend? Note: with this method I have to still build a replica card, but it might be a more accurate representation that what i am doing now (with the SMPs at both ends of the traces). |
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胡bbs2 发表于 2018-9-30 12:51 可能最好的方法是AFR:“自动夹具移除”,可以在PNA上作为选项007购买,或作为PLTS(物理层测试解决方案)软件的一部分购买。 以下是该网页的链接:http://www.keysight.com/en/pd-2401937-pn-N5242A/automatic-fixture-removal-option-007?nid=-33038.1085644.00&cc=US&lc = eng查看有关第29页的小册子。有关PLTS的信息,请访问:http://www.keysight.com/en/pd-1000004594%3Aepsg%3Apro-pn-N1930B/physical-layer-test- 系统PLTS-2012-软件NID = -35190.536881842&安培; CC = US&安培; LC =主机 以上来自于谷歌翻译 以下为原文 Probably the best method is AFR: "Automatic Fixture Removal", which can be purchased as option 007 on the PNA, or as part of the PLTS (Physical Layer Test Solution) software. Here is the link to the webpage: http://www.keysight.com/en/pd-2401937-pn-N5242A/automatic-fixture-removal-option-007?nid=-33038.1085644.00&cc=US&lc=eng Check out the brochure for information, on about page 29. For PLTS, look here: http://www.keysight.com/en/pd-1000004594%3Aepsg%3Apro-pn-N1930B/physical-layer-test-system-plts-2012-software?nid=-35190.536881842&cc=US&lc=eng |
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