帮助指数为我在第一天摸索提供了足够的线索。
虽然模拟结果让我想知道我是否正确地做到了。
我选择在已经投入生产的成熟天线设计上开始我的模拟。
这是一款900MHz倒F,适用于我们(+4.1 dBi)并且相当全向。
当我在Genesys重建它时,这场比赛非常可怕。
在硬件方面,我看到S11在910 - 930MHz之间的性能优于-16dB。
我的模拟显示S11在500MHz时最佳情况为-3.6dB?
我没想到它会与所做的相提并论,但我确实期待一些比这更接近的东西。
我想我在构建Genesys模型时做了一个不好的假设。
我遵循的步骤如下。
我用微带元件制作了天线。
然后我在布局中将元素拉到一起。
然后,我倾倒了一个与之前在顶层实施的地面相匹配的地平面。
然后我在顶部下方放置了另一个12.4mil的地平面来重建内部地平面。
然后我放置一个矩形的基板来代表天线下面的PCB芯材料。
这些看起来像是一种糟糕的方法吗?
我附上了Genesys文件和原始天线的片段谢谢-Nick-
GEN_900MHZ_INV_F.zip4.7 MB
以上来自于谷歌翻译
以下为原文
The help index has provided enough clues for me to fumble through my first day. Though the simulation results have me wondering if I did it correctly. I chose to start my simulations on a proven antenna design that has gone into production. It is a 900MHz inverted F that preformed well for us(+4.1 dBi) and fairly omni-directional.
When I reconstructed it in Genesys the match is horrible. In hardware I was seeing S11 better than -16dB from 910 - 930MHz. My simulations show S11 best case of -3.6dB at 500MHz? I didn't expect it to be a match to what was made but I did expect something a bit closer than that. I imagine that I have made a bad assumption in constructing my Genesys model. The steps I followed are below.
I built my antenna using microstrip elements.
I then pulled the elements together in layout.
I then poured a ground plane that matched what I previously implemented on top layer.
I then placed another ground plane 12.4mil below top to recreate the internal ground plane.
I then placed a rectangle of substrate to represent the PCB core material beneath the antenna.
Does any of that seem like a bad approach? I have attached the Genesys files and a snip of the original antenna
Thanks
-Nick-
附件
帮助指数为我在第一天摸索提供了足够的线索。
虽然模拟结果让我想知道我是否正确地做到了。
我选择在已经投入生产的成熟天线设计上开始我的模拟。
这是一款900MHz倒F,适用于我们(+4.1 dBi)并且相当全向。
当我在Genesys重建它时,这场比赛非常可怕。
在硬件方面,我看到S11在910 - 930MHz之间的性能优于-16dB。
我的模拟显示S11在500MHz时最佳情况为-3.6dB?
我没想到它会与所做的相提并论,但我确实期待一些比这更接近的东西。
我想我在构建Genesys模型时做了一个不好的假设。
我遵循的步骤如下。
我用微带元件制作了天线。
然后我在布局中将元素拉到一起。
然后,我倾倒了一个与之前在顶层实施的地面相匹配的地平面。
然后我在顶部下方放置了另一个12.4mil的地平面来重建内部地平面。
然后我放置一个矩形的基板来代表天线下面的PCB芯材料。
这些看起来像是一种糟糕的方法吗?
我附上了Genesys文件和原始天线的片段谢谢-Nick-
GEN_900MHZ_INV_F.zip4.7 MB
以上来自于谷歌翻译
以下为原文
The help index has provided enough clues for me to fumble through my first day. Though the simulation results have me wondering if I did it correctly. I chose to start my simulations on a proven antenna design that has gone into production. It is a 900MHz inverted F that preformed well for us(+4.1 dBi) and fairly omni-directional.
When I reconstructed it in Genesys the match is horrible. In hardware I was seeing S11 better than -16dB from 910 - 930MHz. My simulations show S11 best case of -3.6dB at 500MHz? I didn't expect it to be a match to what was made but I did expect something a bit closer than that. I imagine that I have made a bad assumption in constructing my Genesys model. The steps I followed are below.
I built my antenna using microstrip elements.
I then pulled the elements together in layout.
I then poured a ground plane that matched what I previously implemented on top layer.
I then placed another ground plane 12.4mil below top to recreate the internal ground plane.
I then placed a rectangle of substrate to represent the PCB core material beneath the antenna.
Does any of that seem like a bad approach? I have attached the Genesys files and a snip of the original antenna
Thanks
-Nick-
附件
举报