是否可以在LSM9DS1传感器上进行包覆成型？

嗨，这个问题是关于LSM9DS1传感器PCBA的电子封装
我们不打算将其包装在塑料外壳中，而是计划用包覆成型材料覆盖PCBA，以覆盖整个PCB，包括传感器，以保护其免受潮湿和环境的影响。
鉴于它是MEMS，是否可以在LSM9DS1传感器上进行包覆成型？如果是，您是否建议任何具体的材料和工艺？

＃lsm9ds1 #overmolding #packaging



以下为原文




Hi, This question is regarding the e-packaging of the LSM9DS1 sensor PCBA
Instead of packaging it in the plastic casing, We are planning to cover the PCBA with the overmolding material to cover the whole PCB including the sensor to protect it from moisture and environment.
Is overmolding advisable over the LSM9DS1 sensor given that it is a MEMS? If yes, do you suggest any specific material and process?

#lsm9ds1 #overmolding #packaging