由Intel、微软、惠普、德州仪器、NEC、ST-NXP等业界巨头组成的USB 3.0 Promoter Group今天宣布,该组织负责制定的新一代USB 3.0标准已经正式完成并公开发布。新规范提供了十倍于USB 2.0的传输速度和更高的节能效率,可广泛用于PC外围设备和消费电子产品。制定完成的USB 3.0标准已经移交给该规范的管理组织USB Implementers Forum(简称USB-IF)。该组织将与硬件厂商合作,共同开发支持USB 3.0标准的新硬件,不过实际产品上市还要等一段时间。 第一版USB 1.0是在1996年出现的,速度只有1.5Mb/s;两年后升级为USB 1.1,速度也大大提升到12Mb/s,至今在部分旧设备上还能看到这种标准的接口;2000年4月,目前广泛使用的USB 2.0推出,速度达到了480Mb/s,是USB 1.1的四十倍;如今八个半年头过去了,USB 2.0的速度早已经无法满足应用需要,USB 3.0也就应运而生,最大传输带宽高达5.0Gb/s,也就是625MB/s,同时在使用A型的接口时向下兼容。 IEEE组织最近也批准了新规范IEEE1394-2008,不过新版FireWire的传输速度只有3.2Gb/s,相当于USB 3.0的60%多一点。难怪苹果等业界厂商普遍对该技术失去了兴趣。 USB 2.0基于半双工二线制总线,只能提供单向数据流传输,而USB 3.0采用了对偶单纯形四线制差分信号线,故而支持双向并发数据流传输,这也是新规范速度猛增的关键原因。 除此之外,USB 3.0还引入了新的电源管理机制,支持待机、休眠和暂停等状态。 测量仪器大厂泰克(Tektronix)在上个月第一家宣布了用于USB 3.0的测试工具,可以帮助开发人员验证新规范与硬件设计之间的兼容性。 USB 3.0在实际设备应用中将被称为“USB SuperSpeed”,顺应此前的USB 1.1 FullSpeed和USB 2.0 HighSpeed。预计支持新规范的商用控制器将在2009年下半年面世,消费级产品则有望在2010年上市。 The authors of this specification would like to recognize the following people who participated in the USB 3.0 Bus Specification technical workgroups. We would also like to acknowledge the many others throughout the industry who provided feedback and contributed to the development of this specification. Promoter Company Employees Alan Berkema Hewlett Packard Anthony Hudson Hewlett Packard Arthur Zarnowitz Hewlett Packard Huimin Chen Intel Corporation Bob Dunstan Intel Corporation Dan Froelich Intel Corporation Brad Hosler Intel Corporation John Howard Intel Corporation Rahman Ismail Intel Corporation Yun Ling Intel Corporation Andy Martwick Intel Corporation Steve McGowan Intel Corporation Duane Quiet Intel Corporation Brad Saunders Intel Corporation Micah Sheller Intel Corporation Clint Walker Intel Corporation Jim Walsh Intel Corporation Kai Wang Intel Corporation Randy Aull Microsoft Corporation Nathan Sherman Microsoft Corporation David Wooten Microsoft Corporation Nobuyuki Mizukoshi NEC Corporation Hajime Nozaki NEC Corporation Kenji Oguma NEC Corporation Hock Seow NEC Corporation "Peter" Chu Tin Teng NEC Corporation
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