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Characterizing and Modeling the Impact of Power/Ground Via Arrays on Power Plane Impedance
Abstract In this paper, the impact of power/ground via arrays on power plane impedance is studied. 8 x 8 via array structures are characterized and the results are compared to fullwave field simulation using HFSS. These results show that the impedance and effective inductance is a strong function of location within the array. The lowest impedance is found on the array perimeter and the impedance is several times higher in the array center. The impact antipad size and dielectric thickness on the plane impedance and inductance is examined using parameterized models. 
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这是汽车360全景控制器上的主板，请问圆圈中的原件是什么，起什么作用？
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