图1. Leyden罐子，通常被认为是第一个电容器（图片来源：howstuffworks.com）
我对大学有很多美好的回忆。
但是，我不得不承认，最后一天可能是最难忘的一天。
不是因为这是我大学生涯的最后一天，而是因为它最终是我们课堂上的“全民免费”。
我们的教练，在毕业前几周，说我们可以在最后一天使用电容器并在某些电路板上鼎盛时期。
所以在这里，你有二十二个令人讨厌的电子技术大学生咀嚼，等待机会制造一些结构性破坏。
嘈杂的砰砰声，令人讨厌的气味和浓浓的浓烟使它成为我永远不会忘记的一天。
早在我们可以在课堂上使用电容器之前，就必须发明电容器。
电容器的发明根据您的要求而有所不同。
有记录表明一位名叫Ewald Georg von Kleist的德国科学家于1745年11月发明了这种电容器。几个月后，Leyden大学的荷兰教授Pieter van Musschenbroek想出了一种类似Leyden罐子的装置（
图1），通常被认为是第一个电容器。
由于克莱斯特没有详细的记录和笔记，也没有他的荷兰同行的恶名，他经常被忽视作为电容器演变的贡献者。
多年来，两者都被赋予了同等的信誉，因为它们的研究是相互独立的，而且只是一个科学的巧合
随着新技术的发展和速度的提高，这可能会产生PI-Power完整性，SI-Signal完整性和EMC-Electro Magnetic兼容性的潜在问题。
为了解决这些问题，3M开发了一种超薄嵌入式电容材料（ECM）。
ECM的平面夹层结构提供比现今的分立式MLCC电容器更高的去耦带宽。
ECM可以作为电源接地层或分立电容器嵌入PCB和芯片封装中。
前期成本偏高，但最终结果提供了简化的电路板布局，更多的成本节省和吸引人的外观。
在图2中，根据您要构建的内容，您可以看到ECM可以替换电路板上的许多分立电容器。
图2. 3M的ECM可以替代许多分立电容器（PCB图像源：3M）
总之，青少年技术显然有利有弊，尤其是当你将它与已经存在270多年的经过验证的电容器进行比较时。
然而，这种新技术是我期待看到它在未来几年如何发展的东西。
参考：
1 - 工作原理“http://electronics.howstuffworks.com/capacitor3.htm”
以上来自于谷歌翻译
以下为原文
![]() Figure 1. The Leyden jar, typically credited as being the first capacitor (Image source: howstuffworks.com)
I have many great memories of college. However, I do have to admit the last day is probably one of the most memorable. Not because it was the last day of my college career, but because it was finally our “free for all” in class. Our instructor, weeks prior to graduation, said we could pop capacitors and have a heyday on some boards on our last day. So here you have twenty-two geeky, electronic technical college students chomping at the bit, and waiting for the opportunity to create some structural havoc. The loud pops, nasty smells, and thick pluming smoke has made it a day I will never forget.
Long before we could pop capacitors in class, the capacitor had to be invented. The invention of the capacitor varies somewhat depending on who you ask. There are records that indicate a German scientist named Ewald Georg von Kleist invented the capacitor in November 1745. Several months later Pieter van Musschenbroek, a Dutch professor at the University of Leyden came up with a very similar device in the form of the Leyden jar (Figure 1), which is typically credited as the first capacitor. Since Kleist didn't have detailed records and notes, nor the notoriety of his Dutch counterpart, he's often overlooked as a contributor to the capacitor's evolution. Over the years, both have been given equal credit as it was established that their research was independent of each other and merely a scientific coincidence.1
As new technology is developed, and increased speed is a must, this can create potential issues with PI-Power integrity, SI-Signal integrity, and EMC-Electro Magnetic compatibility. To help combat these issues, 3M has developed an ultra-thin Embedded Capacitance Material (ECM). The planar sandwich structure of the ECM provides a higher decoupling bandwidth than today’s discrete MLCC capacitors. The ECM can be embedded into PCBs and chip packages as either a power ground plane or a discrete capacitor. Upfront costs are on the higher side, but the end results provide a simplified board layout, more cost savings, and an appealing look. In Figure 2, you can see, depending on what you are trying to build, that the ECM can replace many discrete capacitors on your board.
![]() Figure 2. 3M’s ECM can replace many discrete capacitors (PCB image source: 3M)
In conclusion, there are clearly both pros and cons of adolescent technology, especially when you are comparing it to the tried-and-true capacitor that has been around for 270+ years. However, this new technology is something I’m looking forward to seeing how it advances in the years to come.
Reference:
1 – How Stuff Works “http://electronics.howstuffworks.com/capacitor3.htm”
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