您想学习如何在空间受限，热量密集的汽车应用中冷却您的电子设备吗？
加入我们，于2016年8月9日在密歇根州利沃尼亚的劳雷尔庄园会议中心举办免费研讨会。
来自安森美半导体的着名热学专家Roger Stout将透露如何保持电子产品冷却的秘密，即使在PCB空间限制增加的情况下也是如此。
他还将讨论如何正确阅读制造商的数据表，并揭示他多年来遇到的一些常见误解。
这个为期半天的研讨会将从基础开始，转向线性叠加，RC热模型，热模拟，最后是非线性热现象和热失控。
Roger是安森美半导体技术人员的高级成员，撰写并合着了70多篇技术论文和演讲。
看他的完整生物如下。
活动日程
1:00 PM。
半导体器件热基础知识2:00 pm
稳态热分析2:45 pm
下午3点00分
线性叠加3：下午15点
热RC网络下午4点00分
非线性热现象/热失控
点击这里注册
Roger Stout于1977年在亚利桑那州立大学获得机械工程学士学位，并于1979年在加州理工学院获得MSME学位。之后，他的全职职业生涯开始于摩托罗拉，1999年转为第一次旋转 -
今天，安森美半导体负责监督热和机械表征实验室，该实验室是亚利桑那州凤凰城公司研发部门的包装技术开发组织的一部分。
Roger撰写并合着了70多篇技术论文和演讲。
他是IEEE TCPT期刊（和其他人）的同行评审员。
他曾在ITherm，SemiTherm，APEC，汽车电子可靠性研讨会，InterPACK和电力电子技术展览会等方面教授研讨会。
会议通过IEEE的Expert Now教育网站发布了两场研讨会，在美国和欧洲的安森美半导体“科技日”举办了多次研讨会.Roger还为Electronics Cooling的热咖啡馆举办了三次在线网络研讨会，
200名参与者遍布全球数十个国家。
他曾在ASU的IRA Fulton工程学院担任客座讲师，很荣幸成为2013年SemiTherm执行简报的主题发言人，并于2014年9月在加利福尼亚州圣地亚哥举行的Qualcomm热技术日受邀担任外部主题演讲嘉宾。
Roger拥有六项专利，自1983年以来一直是亚利桑那州的注册专业工程师（机械）。
点击这里注册
合格的参与者可免费注册。
安森美半导体保留限制注册的权利。
以上来自于谷歌翻译
以下为原文
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Do you want to learn how to cool off your electronic devices in space constrained, heat intensive Automotive applications? Join us for a free seminar on August 9th, 2016 at the Laurel Manor Conference Center in Livonia, Michigan.
Noted thermal expert Roger Stout from ON Semiconductor will divulge the secrets of how to keep electronics cool, even with the increasing PCB space constraints. He will also discuss how to properly read a manufacturer’s data sheet and reveal some of the common misunderstandings that he has run into over the years. This half-day seminar will start with the basics and move to linear superposition, RC thermal models, thermal simulation, and finally non-linear thermal phenomena and thermal runaway.
Roger is a senior member of ON Semiconductor’s technical staff and has written and coauthored over 70 technical papers and presentations. See his complete bio is below.
Event Agenda
1:00 p.m. Semiconductor Device Thermal Basics
2:00 p.m. Steady State Thermal Analysis
2:45 p.m. Break
3:00 p.m. Linear Superposition
3:15 p.m. Thermal RC Networks
4:00 p.m. Non-Linear Thermal Phenomena / Thermal Runaway
Click here to register
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Roger Stout received his BSE in Mechanical Engineering at ASU in 1977, and as a Hughes Fellow earned his MSME at the California Institute of Technology in 1979. Following that, his full-time career began at Motorola and in 1999 transitioned to its first spin-off, ON Semiconductor, where today he oversees the Thermal and Mechanical Characterization Lab, which is part of the Packaging Technology Development organization within the company’s Corporate Research and Development division in Phoenix, AZ.
Roger has authored and coauthored more than 70 technical papers and presentations. He has been a peer reviewer for the IEEE TCPT Journal (and others). He has taught seminars at ITherm, SemiTherm, APEC, the Automotive Electronics Reliability Workshop, InterPACK, and the Power Electronics Technology Exhibition & Conference, published two seminars through IEEE's Expert Now educational web site, presented numerous seminars at ON Semiconductor “tech days” around the U.S. and Europe Roger has also presented three live-on-line webinars for Electronics Cooling's Thermal Café, viewed by as many as 200 participants spanning several dozen countries around the globe. He has been an occasional guest lecturer at ASU's IRA Fulton College of Engineering, was honored to be the Keynote Speaker for the 2013 SemiTherm Executive Briefing, and in September 2014 was the invited External Keynote Speaker at Qualcomm's Thermal Technology Day in San Diego, CA.
Roger holds six patents, and has been a registered Professional Engineer (Mechanical) in the state of Arizona since 1983.
Click here to register
Registration is free to qualified participants. ON Semiconductor reserves the right to limit registration.
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