半导体行业是否为下一代IVN协议的需求做好充分准备？

电子

我们正在迅速进入一个平台，其中包含在普通汽车中的电子产品数量将超过汽车总价值的一半。
通常，中等价位的车辆现在将安装在50到75个电子控制单元（ECU）之间 - 大约是十年前这种车辆使用的两倍。
然而，通信基础设施没有以相同的速度发展，我们处于网络开始挣扎的位置。
市场分析公司IC Insightsexpect汽车电子系统市场在现在和2019年之间的复合年增长率（CAGR）为6.5％。确保有足够的带宽来应对不断增加的复杂程度，这将是充满挑战的。
实施更有效，更高容量的车载网络（IVN）技术。
目前，大多数IVN倾向于基于控制器局域网（CAN）和本地互连网络（LIN）协议，但是现在出现了许多其他可能在不久的将来发挥重要作用的标准。
以下是需要注意的主要内容：
CAN灵活数据速率（CAN FD） - 与CAN具有相同的核心架构，具有后向兼容性，但支持8Mbps（8倍速，1M标准CAN）。
FlexRay - 此协议提供10Mbps的数据传输速率。
由于内置冗余和容错机制，它非常适合安全关键的汽车应用。
但是，在部署成本和可伸缩性方面存在问题。
以太网 - 这似乎是未来几年广泛实施IVN的一个非常有力的案例。
它已经成为大量电信和数据通信基础设施的基础，目前正在汽车中使用100Mbps的数据传输速率。
下一代1Gbps汽车以太网已经为下一代IVN设计，将在未来2 - 3年内推向市场。
根据Strategy Analytics编制的预测数据，到2020年，每年将在汽车中部署1.2亿个以太网节点。
面向媒体的系统传输（MOST） - 这支持150Mbps数据传输，但具有相对较高的实施成本。
似乎以太网（提供类似的数据速率但更便宜且更易于安装）将获得更多牵引力并有效地边缘化MOST。
在IVN实施中使用的高灵敏度半导体器件需要充分保护，以免受汽车环境带来的电气威胁 - 例如电磁干扰（EMI）和静电放电（ESD）。
安森美半导体正在与汽车制造商及其一级/二级供应合作伙伴合作，为他们提供更先进的保护解决方案，以应对即将到来的IVN部署。
安森美半导体最新的NUPand ESD系列保护系列包括用于CANFD的全新NUP2125双线总线保护，具有极低的电容，低钳位，小封装和高达±30kV的ESD保护以及ISO脉冲抗扰度。

以上来自于谷歌翻译

以下为原文

We are rapidly reaching a stage where the quantity of electronics incorporated into the average car will be more than half of the car’s total value. Generally a mid-price vehicle will now have somewhere between 50 and 75 electronic control units (ECUs) fitted - approximately twice what such vehicles utilized just ten years ago. However, the communication infrastructure has not developed at the same rate and we are left in a position where the networks are starting to struggle.

Market analyst firm IC Insights expects the automotive electronics systems market to experience a compound annual growth rate (CAGR) of 6.5% between now and 2019. Ensuring that there is enough bandwidth available to cope with the increasing levels of complexity is going to prove challenging without the implementation of more effective, higher capacity in-vehicle network (IVN) technologies.
Currently the majority of IVNs tend to be based on controller area network (CAN) and local interconnect network (LIN) protocols, but there are a multitude of other standards that are now emerging which might have important roles to play in the near future. Here are the main ones to be aware of:

CAN Flexible Datarate (CAN FD) - This shares the same core architecture as CAN, with back compatibility, but supports 8Mbps (8x the standard CAN at 1Mbps).
FlexRay - This protocol offers data transfer rates of 10Mbps. Thanks to built-in redundancy and fault tolerance mechanisms it is highly suited to safety-critical automotive applications. There are issues, however, in relation to deployment costs and scalability.
Ethernet - This seems to have a very strong case for extensive IVN implementation over the coming years. Already the foundation of a great deal of telecom and data communication infrastructure, it is currently being used in automotive with 100Mbps data transfer rates. The next generation 1Gbps Automotive Ethernet has been in design for the next generation IVN due to be introduced to the market in the next 2-3 years. A combined 120 million Ethernet nodes per year will be deployed in automobiles by 2020 according to forecast data compiled by Strategy Analytics.
Media-Oriented Systems Transport (MOST) - This supports 150Mbps data transfer, but has relatively high implementation costs associated with it. It appears likely that Ethernet (which offers similar data rates but is cheaper and simpler to install) will get more traction and effectively marginalize MOST.

The highly sensitive semiconductor devices that are set be used in IVN implementation need adequate protection from the electrical threats that an automotive environment presents - such as electro-magnetic interference (EMI) and electro-static discharge (ESD). ON Semiconductor is collaborating with automobile manufacturers and their tier-1/tier-2 supply partners to provide them with more advanced protection solutions to address forthcoming IVN deployments. ON Semiconductor’s latest family of NUP and ESD series protection include the all new NUP2125 dual line bus protection for CANFD with very low capacitance, low clamping, small packaging and ESD protection up to ±30kV as well as immunity from ISO pulses.

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半导体行业是否为下一代IVN协议的需求做好充分准备？

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