电子封装失效分析技术&元器件讲解

目录

Catalog

培训内容/时间

Course title

课程内容

Content

失效分析

Failure analysis

常用失效分析流程和工具

Failure analysis and tools

1天

1day

·         失效定义及分类 Definition and classification of failures

·         电子产品为何失效 Why do electronic products fail?

·         失效分析的目标 The objectives of failure analysis

·         失效分析的重要性 Understand the importance of failure analysis

·         失效分析的思想方法 Philosophical approach of failure analysis

·         失效分析技术线路 Technique approach of failure analysis

·         失效分析流程 Failure analysis flow charts

·         常用失效分析无损检测工具 Nondestructive analysis tools for failure analysis

·         常用失效分析物理解剖和定位工具Destructive analysis tools and failure isolation tools

失效分析

Failure analysis

电子封装失效分析

Electronic package and failure analysis

0.5天

0.5 day

·         失效定义及分类 Definition and classification of failures

·         电子产品为何失效 Why do electronic products fail?

·         失效分析的目标 The objectives of failure analysis

·         失效分析的重要性 Understand the importance of failure analysis

·         失效分析的思想方法 Philosophical approach of failure analysis

·         失效分析技术线路 Technique approach of failure analysis

·         失效分析流程 Failure analysis flow charts

·         解决问题的8D方法 Eight disciplines (8D) in problem solving

·         元器件典型失效模式和机理 Typical failure modes and failure mechanisms of electronics components

·         典型封装产品失效分析案例 Case study for electronic package failure analysis

失效分析

Failure analysis

Soldering & Solder Joint Failure Analysis

焊接及焊点失效分析

0.5 天

0.5 day

·         失效定义及分类 Definition and classification of failures

·         电子产品为何失效 Why do electronic products fail?

·         失效分析的目标 The objectives of failure analysis

·         失效分析的重要性 Understand the importance of failure analysis

·         失效分析的思想方法 Philosophical approach of failure analysis

·         失效分析技术线路 Technique approach of failure analysis

·         失效分析流程 Failure analysis flow charts

·         解决问题的8D方法 Eight disciplines (8D) in problem solving

·         焊点失效分析流程 Typical flow chart for solder joint failure analysis

·         焊点失效典型模式及分析方法 Typical failure modes and analysis method

·         典型焊点失效分析案例 Case study for solder joint failure analysis