线路板UL796认证申请样品要求

1 Scope

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
Cover
Transmittal
Table of Contents
Body
INTRODUCTION
1 Scope
2 Glossary
3 Units of Measurement
4 Measurement Accuracy and Testing Conditions
5 Supplementary Test Procedures
6 References
7 General
CONSTRUCTION
8 General
9 Base Materials
10 Conductors
11 Adhesives for Conductor Bonding
12 Processes
13 Permanent Coatings
14 Plugged-Hole Materials
15 Embedded Components
16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
17 Multilayer Printed-Wiring Boards
18 Metal Base Printed-Wiring Boards
19 Flexible Printed-Wiring Boards
20 Variations In Printed-Wiring Board Construction
PERFORMANCE
21 Test Samples
22 Data Collection
23 Microsection Analysis
24 Thermal Shock
25 Flammability
26 Bond Strength
27 Delamination and Blistering
28 Dissimilar Dielectric Materials Thermal Cycling Test
29 Plating Adhesion
30 Conductive Paste Adhesion Test
31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
32 Silver Migration Test
MARKINGS
33 General
FOLLOW-UP INSPECTION
Wiring, Printed - Component


The devices covered under this category are incomplete in certain constructional features or restricted in performance capabilities and are intended for use as components of equipment submitted for investigation rather than for direct separate installation in the field. THE FINAL ACCEPTANCE OF THE COMPONENT IS DEPENDENT UPON ITS INSTALLATION AND USE IN EQUIPMENT SUBMITTED TO UL

GENERAL

The category covers printed wiring boards intended for use as components in devices or appliances. The boards may use organic or inorganic base materials in a single or multilayer, rigid or flexible form. Circuitry construction may include etched, die-stamped, precut, flush press, additive, and plated-conductor techniques. Printed-component parts may be used.

This category covers flexible printed wiring defined by the cross-sectional configuration, including right-angle conductors, mid-point connections, etc. This category does not cover flexible printed wiring where the cross-sectional configuration is the same for the entire length of the product. The latter construction is covered under Appliance Wiring Material (AVLV2).

The tests may include the determination of material flammability (burning characteristics), conductor adhesion, delamination, and silver migration. In addition, the effect of long-term exposure to elevated temperature (air-oven aging) on property retention may be investigated. Levels of performance characteristics required for a particular end-product application are intended to be in accordance with the requirements of the end-product standard. Due to space limitations, only a limited number of property values may be presented in the individual Recognitions. Additional properties may be found in the individual Reports.

Minimum Cladding Conductor Width — The minimum width of any conductor spaced more than 0.4 mm from the edge of the printed wiring board.

Minimum Edge Cladding Conductor Width — The minimum width of any conductor parallel with and not spaced more than 0.4 mm from the edge of the printed wiring board.

Cladding Conductor Thickness — The minimum metallic cladding thickness of the conductor. The cladding thickness represents the copper conductor thickness only, unless otherwise noted.

Number of Clad Sides — Indicates whether the printed wiring boards have a pattern on one side (denoted as single sided [SS]) or on both sides (denoted as double sided [DS]).

Maximum Area Diameter — The maximum unpierced conductor area of a printed wiring board is judged by the diameter of the largest circle that can be inscribed within the pattern.

Solder Limits — Unless designed for hand-soldering only, each printed wiring board construction is assigned a maximum temperature and dwell time. The tabulated levels are the maximum temperature and cumulative time conditions to which the boards may be subjected during assembly of components. Multiple solder limits are used to represent surface-mount technology (SMT) soldering process maximum temperature and time profiles.

Maximum Operating Temperature — The maximum continuous-use temperature to which the printed wiring board may be exposed under normal operating conditions in the end product .

Flammability Classification — Processed printed wiring boards with or without applied coatings, finishes, etc., as supplied to the device or appliance manufacturer, may be classified based on burning tests conducted in accordance with ANSI/UL 94, "Tests for Flammability of Plastic Materials for Parts in Devices and Appliances," at the option of the manufacturer.

Where such testing has been conducted, the printed wiring board is classified as HB, V-0, V-1, V-2, VTM-0, VTM-1 and/or VTM-2 .

Conductor Finishes — Metallic plating on conductors, contact fingers, plated thru-holes, etc., may be tested at the option of the manufacturer.

Direct Support of Current-carrying Parts — A printed wiring board that meets the minimum ANSI/UL 796, "Printed-Wiring Boards," levels of direct support of current-carrying parts is identified to enable the OEM to select appropriate printed wiring boards for use in products. Direct support is not investigated for "Flammability Only" boards and should be considered during the end-product investigation.

The required performance levels are shown below: