据我所知,LSM330DLC是一个“系统级封装”,它是一个单独的加速度计和陀螺仪芯片封装在一起。实际的模具零件数量是多少?
我问的原因是LSM330DLC很难解释寄存器中各个位的作用。这些位似乎与LIS3DH匹配,但实际的寄存器地址是不同的。
此外,LIS3DH具有块数据更新(BDU)功能,可安全读取多字节(10和12位)数据寄存器,LSM330DLC表示不启用此功能。如何在没有损坏读数的情况下安全读取多字节数据?
底线问题是LSM330DLC的其他支持文档是什么? LIS3DH和AN3308似乎很接近,但不是完全匹配。
#lsm330dlc
以上来自于谷歌翻译
以下为原文
It is my understanding that the LSM330DLC is a 'System-In-Package', that is it is a separate accelerometer and gyro die packaged together. What are the actual die part numbers?
The reason I ask is that the LSM330DLC is rather spares on explana
tion of what the various bits in the registers do. Bit wise the bits seem to match the LIS3DH, however the actual register addresses are different.
Also the LIS3DH has the Block Data Update (BDU) feature to safely read the multi-byte (10 and 12 bit) data registers, where the LSM330DLC says not to enable this. How can the mutil-byte data be safely read without corrupted readings?
The bottom line question is what other supporting documentation is there for the LSM330DLC? LIS3DH and AN3308 seem close, however are not an exact match.
#lsm330dlc