从16754A LA板更换FPGA芯片散热器有什么困难吗？

我会检查，但是这些信息可能会在时间的迷雾中消失。该卡在2005年的某个时候停止使用，并在2010年8月“失去支持”。安捷伦的制造业在此期间已经开始转移，因此追逐旧的制造流程
可能不可能.Al



     以下为原文

  I'll check, but that information may be lost in the mists of time.

That card was discontinued sometime in 2005, and went 'Out of Support' in August 2010. Agilent's manufacturing has moved in the meantime, so chasing down old manufacturing processes may not be possible.

Al

不幸的是，当一个散热器与插槽A的上边缘缠绕在一起时，有一个散热片从板上掉下来（有一些金属线干扰了散热器结构）。



     以下为原文

  Unfortunately, one heatsink fell off the board when I had to apply force after it was entangled
with the upper edge of the slot A (there are some metal threads that interfered with the heatsink
structure).

我已经能够使用芯片上的MX-4和散热器外边缘上的Arctic Alumina Thermal Adhesive重新连接散热器。
唯一的缺点是这个程序非常永久地粘合散热器的压力因此需要避免任何错误。



     以下为原文

  I have been able to reattach the heatsink using MX-4 on the chip and Arctic Alumina Thermal Adhesive
on the outer margins of the heatsink. The only downside is the stress that this procedure glues the
heatsink quite permanently hence the need to avoid any mistakes while doing it.