尝试运行CORDIC代码时遇到错误,该代码表示:
error1:Pack:2309 - 找到太多类型为“IBUF”的绑定组件适合此设备。
error2:Pack:18 - 对于给定的设备和包,设计太大。
请查看“设计摘要”部分,了解设计的哪个资源要求超出了设备中可用的资源。
我看到了设计摘要:“保税IOB数量”的利用率为121%,其他低于100%。
这是什么意思,我该如何纠正呢?
我附上了我所指的论文,代码如下
模块cordic(z0,x0,y0,xn,yn,en);输入有符号[15:0] z0,x0,y0;输入en;输出有符号[15:0] xn,yn; reg [15:0] xn
,yn;参数[3:0] iter = 4'd14; reg签署[15:0] thetai; reg [3:0] ii = 0; reg [3:0] i; reg签署[15:0] zi
,xi,yi,xtemp,ytemp; reg di; reg [15:0] pi = 16'b0110010010000111; reg [15:0] pi2 = 16'b0011001001000011;总是@(en)beginif(z0 [15] == 0
)beginif(z0 [14:13]> 2'd1)beginxi = 0-y0; yi = x0; zi = z0-pi2; endelsebeginxi = x0; yi = y0; zi = z0; endendelse if(z0 [15] =
= 1)beginif(Z0 [14:13]> 2'd1)beginxi = Y0; YI = 0-X0;滋= Z0 + PI2; endelsebeginxi = X0; YI = Y0;滋= Z0; endendxn = 0;炔=
0;对于(II = 0; iibeginytemp =(YI >>>ⅱ); xtemp =(XI >>>ⅱ);如果(ZI [15] == 0)beginxn = XI-ytemp;炔=义+ xtemp;
滋=滋thetai [II]; endelsebeginxn = XI + ytemp;炔=苡xtemp;滋=滋+ thetai [II]; endxi = XN; YI =炔; //结束XN = XN /一种; //炔
= YN / AN; endendmodule
以上来自于谷歌翻译
以下为原文
I got an error while trying to run CORDIC code which said:
error1: Pack:2309 - Too many bonded comps of type "IBUF" found to fit this device.
error2: Pack:18 - The design is too large for the given device and package.
Please check the Design Summary section to see which resource requirement for
your design exceeds the resources available in the device.
I saw the Design summary: the percentage utilization of "number of bonded IOBs" is 121%, others are below 100%. what does this mean and how can I correct it?
I have attached the paper I am referring and the code is as follows
module cordic(z0,x0,y0,xn,yn,en);
input signed [15:0]z0,x0,y0;
input en;
output signed [15:0]xn,yn;
reg [15:0]xn,yn;
parameter [3:0]iter=4'd14;
reg signed [15:0]thetai;
reg [3:0]ii=0;
reg [3:0]i;
reg signed [15:0]zi,xi,yi,xtemp,ytemp;
reg di;
reg [15:0]pi=16'b0110010010000111;
reg [15:0]pi2=16'b0011001001000011;
always @(en)
begin
if(z0[15]==0)
begin
if(z0[14:13]>2'd1)
begin
xi=0-y0;
yi=x0;
zi=z0-pi2;
end
else
begin
xi=x0;
yi=y0;
zi=z0;
end
end
else if(z0[15]==1)
begin
if(z0[14:13]>2'd1)
begin
xi=y0;
yi=0-x0;
zi=z0+pi2;
end
else
begin
xi=x0;
yi=y0;
zi=z0;
end
end
xn=0;
yn=0;
for(ii=0;ii
begin
ytemp=(yi>>>ii);
xtemp=(xi>>>ii);
if(zi[15]==0)
begin
xn=xi-ytemp;
yn=yi+xtemp;
zi=zi-thetai[ii];
end
else
begin
xn=xi+ytemp;
yn=yi-xtemp;
zi=zi+thetai[ii];
end
xi=xn;
yi=yn;
end
//xn=xn/An;
//yn=yn/An;
end
endmodule
尝试运行CORDIC代码时遇到错误,该代码表示:
error1:Pack:2309 - 找到太多类型为“IBUF”的绑定组件适合此设备。
error2:Pack:18 - 对于给定的设备和包,设计太大。
请查看“设计摘要”部分,了解设计的哪个资源要求超出了设备中可用的资源。
我看到了设计摘要:“保税IOB数量”的利用率为121%,其他低于100%。
这是什么意思,我该如何纠正呢?
我附上了我所指的论文,代码如下
模块cordic(z0,x0,y0,xn,yn,en);输入有符号[15:0] z0,x0,y0;输入en;输出有符号[15:0] xn,yn; reg [15:0] xn
,yn;参数[3:0] iter = 4'd14; reg签署[15:0] thetai; reg [3:0] ii = 0; reg [3:0] i; reg签署[15:0] zi
,xi,yi,xtemp,ytemp; reg di; reg [15:0] pi = 16'b0110010010000111; reg [15:0] pi2 = 16'b0011001001000011;总是@(en)beginif(z0 [15] == 0
)beginif(z0 [14:13]> 2'd1)beginxi = 0-y0; yi = x0; zi = z0-pi2; endelsebeginxi = x0; yi = y0; zi = z0; endendelse if(z0 [15] =
= 1)beginif(Z0 [14:13]> 2'd1)beginxi = Y0; YI = 0-X0;滋= Z0 + PI2; endelsebeginxi = X0; YI = Y0;滋= Z0; endendxn = 0;炔=
0;对于(II = 0; iibeginytemp =(YI >>>ⅱ); xtemp =(XI >>>ⅱ);如果(ZI [15] == 0)beginxn = XI-ytemp;炔=义+ xtemp;
滋=滋thetai [II]; endelsebeginxn = XI + ytemp;炔=苡xtemp;滋=滋+ thetai [II]; endxi = XN; YI =炔; //结束XN = XN /一种; //炔
= YN / AN; endendmodule
以上来自于谷歌翻译
以下为原文
I got an error while trying to run CORDIC code which said:
error1: Pack:2309 - Too many bonded comps of type "IBUF" found to fit this device.
error2: Pack:18 - The design is too large for the given device and package.
Please check the Design Summary section to see which resource requirement for
your design exceeds the resources available in the device.
I saw the Design summary: the percentage utilization of "number of bonded IOBs" is 121%, others are below 100%. what does this mean and how can I correct it?
I have attached the paper I am referring and the code is as follows
module cordic(z0,x0,y0,xn,yn,en);
input signed [15:0]z0,x0,y0;
input en;
output signed [15:0]xn,yn;
reg [15:0]xn,yn;
parameter [3:0]iter=4'd14;
reg signed [15:0]thetai;
reg [3:0]ii=0;
reg [3:0]i;
reg signed [15:0]zi,xi,yi,xtemp,ytemp;
reg di;
reg [15:0]pi=16'b0110010010000111;
reg [15:0]pi2=16'b0011001001000011;
always @(en)
begin
if(z0[15]==0)
begin
if(z0[14:13]>2'd1)
begin
xi=0-y0;
yi=x0;
zi=z0-pi2;
end
else
begin
xi=x0;
yi=y0;
zi=z0;
end
end
else if(z0[15]==1)
begin
if(z0[14:13]>2'd1)
begin
xi=y0;
yi=0-x0;
zi=z0+pi2;
end
else
begin
xi=x0;
yi=y0;
zi=z0;
end
end
xn=0;
yn=0;
for(ii=0;ii
begin
ytemp=(yi>>>ii);
xtemp=(xi>>>ii);
if(zi[15]==0)
begin
xn=xi-ytemp;
yn=yi+xtemp;
zi=zi-thetai[ii];
end
else
begin
xn=xi+ytemp;
yn=yi-xtemp;
zi=zi+thetai[ii];
end
xi=xn;
yi=yn;
end
//xn=xn/An;
//yn=yn/An;
end
endmodule
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