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8引脚LLP散热性能和设计指南

2009-1-13 18:25

<p><font face="Verdana">8引脚LLP散热性能和设计指南</font><br/></p>
<p><font face="Verdana">The new leadless leadframe package (LLP) provides signIFicantly<br/>increased power dissipation capability in a tiny<br/>suRFace-mount package. The key feature of the LLP is that it<br/>has a center metal area located directly below the die which<br/>allows a direct path for heat to flow out, providing very low<br/>thermal resistance. When this pad is connected to PC board<br/>copper to provide heatsinking, values of total thermal resistance<br/>(junction-to-ambient) below 40°C/W can be obtained in<br/>still air environments.</font></p>
3vTreaaO.pdf (59.98 KB)
(下载次数: 14, 2009-1-13 18:25 上传)
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