MTBF（平均故障间隔时间）不等于寿命——它们是非常不同的。MTBF，通常以小时表示，当设备处于“浴盆”曲线的正常生命部分时是“故障率”。如果你用一个100000小时的MTBF指定一个设备，你在这个领域有1000个单位，你会期望每四天出现一个故障（96小时＝100小时X 1000设备＝100000个设备小时）。Lifetime是一个设备或产品的可用寿命，并且由某种O决定。F磨损机制。例如，风扇是非常可靠的（MTBF为100万小时或更长），但寿命有限（对于便宜的套筒轴承来说可能是5-8000小时，对于高质量的球轴承来说可能是40-5万小时）。风扇失效的最终原因通常是轴承的磨损。对于在正常人的环境温度下运行的集成电路，在人的一生中没有有效的磨损机制。在非常高的温度（100-200°C）下工作的器件可能会有寿命问题，因为扩散继续扩散，直到器件不再工作或金属化在温度和电压应力下迁移，从而产生开放或短路。温度循环，例如在商业或军用飞机中，从地面温度到每天40℃到80°C的多次转换，也会导致由于反复弯曲/膨胀/收缩的模具、模具连接或粘结线附着而导致的磨损失效。因此，第一个问题是：Microchip是“MTBF是什么？”第二个问题是“这是怎么决定的？”如果它是一些计算，那么这个数字基本上是没有意义的，除了作为与其他设备的比较，MTBF以同样的方式计算。如果MTBF是通过受控的寿命试验确定的，那么就有一些可以依赖的数字。
以上来自于百度翻译
以下为原文
MTBF (mean time between failure) is not equal to lifetime - they are very different things.
MTBF, usually expressed in hours, is a *rate" of failure when the device is in the usual life part of the "bathtub" curve. If you use a device is specified with an MTBF of 100,000 hours, and you have 1000 units in the field, you would expect a failure about every four days (96 hours => 100 hours x 1000 devices = 100,000 device hours).
Lifetime is the useful life of a device or product and is determined by some kind of wear out mechanism. For example, fans are very reliable (MTBF of 1 million hours or more) but have limited life (maybe 5-8,000 hours for a cheap sleeve bearing, maybe 40-50,000 hours for a good quality ball bearing). The ultimate cause of failure of a fan is usually the wear out of the bearing.
For an integrated circuit operating in normal people ambient temperatures, there is effectively no wear out mechanism within a human lifetime. Devices that operate at very high temperatures (100-200 °C) can have lifetime issues due to the diffusion continuing to diffuse until the device no longer works or metallization migrating under temperature and voltage stress to create an open or a short. Temperature cycling, such as in commercial or military aircraft that transition from ground temperatures to -40 °C to -80 °C multiple times a day, can also cause a wear out failure due to repeated flexing/expansion/contraction of the die, die attach, or bond wire attach.
So the first question for Microchip is "What is the MTBF?" The second question is "How was that determined?". If it was some calculation then the number is basically meaningless except as a comparison to other devices for this the MTBF was calculated in the same way. If the MTBF is determined by a controlled life testing, then there is some substance to the number that you can probably rely upon.
MTBF（平均故障间隔时间）不等于寿命——它们是非常不同的。MTBF，通常以小时表示，当设备处于“浴盆”曲线的正常生命部分时是“故障率”。如果你用一个100000小时的MTBF指定一个设备，你在这个领域有1000个单位，你会期望每四天出现一个故障（96小时＝100小时X 1000设备＝100000个设备小时）。Lifetime是一个设备或产品的可用寿命，并且由某种O决定。F磨损机制。例如，风扇是非常可靠的（MTBF为100万小时或更长），但寿命有限（对于便宜的套筒轴承来说可能是5-8000小时，对于高质量的球轴承来说可能是40-5万小时）。风扇失效的最终原因通常是轴承的磨损。对于在正常人的环境温度下运行的集成电路，在人的一生中没有有效的磨损机制。在非常高的温度（100-200°C）下工作的器件可能会有寿命问题，因为扩散继续扩散，直到器件不再工作或金属化在温度和电压应力下迁移，从而产生开放或短路。温度循环，例如在商业或军用飞机中，从地面温度到每天40℃到80°C的多次转换，也会导致由于反复弯曲/膨胀/收缩的模具、模具连接或粘结线附着而导致的磨损失效。因此，第一个问题是：Microchip是“MTBF是什么？”第二个问题是“这是怎么决定的？”如果它是一些计算，那么这个数字基本上是没有意义的，除了作为与其他设备的比较，MTBF以同样的方式计算。如果MTBF是通过受控的寿命试验确定的，那么就有一些可以依赖的数字。
以上来自于百度翻译
以下为原文
MTBF (mean time between failure) is not equal to lifetime - they are very different things.
MTBF, usually expressed in hours, is a *rate" of failure when the device is in the usual life part of the "bathtub" curve. If you use a device is specified with an MTBF of 100,000 hours, and you have 1000 units in the field, you would expect a failure about every four days (96 hours => 100 hours x 1000 devices = 100,000 device hours).
Lifetime is the useful life of a device or product and is determined by some kind of wear out mechanism. For example, fans are very reliable (MTBF of 1 million hours or more) but have limited life (maybe 5-8,000 hours for a cheap sleeve bearing, maybe 40-50,000 hours for a good quality ball bearing). The ultimate cause of failure of a fan is usually the wear out of the bearing.
For an integrated circuit operating in normal people ambient temperatures, there is effectively no wear out mechanism within a human lifetime. Devices that operate at very high temperatures (100-200 °C) can have lifetime issues due to the diffusion continuing to diffuse until the device no longer works or metallization migrating under temperature and voltage stress to create an open or a short. Temperature cycling, such as in commercial or military aircraft that transition from ground temperatures to -40 °C to -80 °C multiple times a day, can also cause a wear out failure due to repeated flexing/expansion/contraction of the die, die attach, or bond wire attach.
So the first question for Microchip is "What is the MTBF?" The second question is "How was that determined?". If it was some calculation then the number is basically meaningless except as a comparison to other devices for this the MTBF was calculated in the same way. If the MTBF is determined by a controlled life testing, then there is some substance to the number that you can probably rely upon.
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