大约10年前，凌力尔特公司推出了革命性的产品系列uModule。
现在称为Power by Linear™/ Analog Devices，uModule器件配有电源开关和电源开关。
DC / DC控制器，二极管，电容器，电阻器和磁性元件，均采用封装热增强型BGA或LGA封装。
见下图。
uModules是完整电源管理解决方案中的优秀产品，可最大限度地减少工程师从头开始设计系统的需求。
它们在减小的电路板空间内提供经过验证的解决方
这意味着随着上市时间和成本的降低，可靠性会上升。
在2010年，这些器件尺寸为15 mm x 15 mm x 5 mm，输出电流高达50安培。
uModules现在经历了第二次尺寸缩小的变革，但性能却在不断提高。
最近发布的LTM4678是采用16 mm x 16 mm封装的单个50 Amp或双25 Amp器件。
2018年第三季度推出两款令人兴奋的设备。
LTM4688采用相同的16 mm x 16 mm封装，是单个60 Amp或双30 Amp器件，不久之后是LTM4700。
该器件采用单个100安培器件或双50安培器件，采用15 mm x 22 mm x 7.82 mm小型封装。
LTM4700的效率接近90％，从1伏特到12伏特，100安培输出，200 LFM。
LTM4700可以采用菊花链式连接，以实现超过500安培的输出。
关于这些新uModules的首要问题之一是器件没有像早期的uModule那样完全封装。
原因很简单，就是散热。
封装的磁性元件保持热量，随着功率输出的不断增加，热量的可能性也会增加。
使用新封装时，磁性元件不会被封装，因此内置散热器可以更容易地散热。
LTM4678，LTM4680和LTM4700只是uModule电源管理器件第二次革命的开始。
其他设备将提供成熟的解决方案，最小化电路板空间，同时提高性能，缩短产品上市时间。
对于那些在设计中加入这些新uModule的人来说，可能会获得潜在的财务收益。
参考文献：
1 - https://ez.analog.com/docs/DOC-1 ... es-sip-packagingpdf
2 - http://www.analog.com/cn/product ... lators/ltm4678.html
以上来自于谷歌翻译
以下为原文
Roughly 10 years ago, Linear Technology came out with a revolutionary line of products known as uModule. Now known as Power by Linear™ / Analog Devices, uModule devices come complete with power switches & DC/DC controllers, diodes, capacitors, resistors, and magnetics, all in one encapsulated thermally enhanced BGA or LGA package. See image below.
uModules are an excellent offering in a complete power management solution that minimize the need for the engineer to design a system from scratch. They offer proven solutions in reduced board space that have excellent thermal properties. This means that reliability goes up as time to market and cost is reduced. In 2010 these devices were small at 15 mm x 15 mm x 5 mm and had outputs up to 50 amps.
uModules are now going through a second revolution of size shrinkage but increasing performance. The recently released LTM4678 is a single 50 Amp or dual 25 Amp device in a 16 mm x 16 mm package. Coming out in the 3rd quarter of 2018 are two exciting devices. The LTM4688 is a single 60 Amp or dual 30 Amp device in the same 16 mm x 16 mm package, and shortly after that is the LTM4700. This device is a single 100 Amp device or dual 50 Amp device in a small 15 mm x 22 mm x 7.82 mm package. The LTM4700 is close to 90% efficient from 1 Volts to 12 Volts at 100 Amps output with 200 LFM. The LTM4700 can be daisy chained for scaling to more than 500 Amps of output.
One of the first things noticeable about these new uModules are that the devices are not fully encapsulated as the earlier uModules. The reason is simple, it is for heat dissipation. Encapsulated magnetics retain heat and as power outputs continue to increase, so does the potential of heat. With the new packages, the magnetics are not encapsulated so that heat can be dissipated easier with the built-in heatsinks.
The LTM4678, LTM4680 and LTM4700 are just the start of the second revolution in uModule power management devices. Other devices will follow in offering proven solutions, minimizing board space while increasing performance, and decreasing time to market. Potential financial gains can be had for those that incorporate these new uModules in their designs.
References:
1 – https://ez.analog.com/docs/DOC-1 ... es-sip-packagingpdf
2 – http://www.analog.com/en/product ... lators/ltm4678.html
