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我正在寻找Linux补丁来支持S70GL02GS闪存。根据这个KB文章(Linux下的S70GL02GS支持-KBA218966),您必须创建一个支持案例来接收补丁。我已经这么做了,但到目前为止我只收到自动回复。 我还感兴趣的是如何指定在加载时Linux解析的设备树源(.DTS)文件中的S70GL02GS。对于一个典型的CFI兼容的2MBIT、128MX16和Flash,我希望它的条目看起来像这样: NoFlash @ 0,0{ 地址单元=& lt;0x1gt; 大小的细胞= & lt;0x1gt; 兼容=“CFI闪存”; Rg=& lt;0x0 0x0 0x1000000; 银行宽度= & lt;0x2 & gt; 器件宽度=<0x1gt; 但是S70GL02GS实际上是同一封装中的两个1Mb/Flash芯片(S29 GL01GS)。因此,有一个外部芯片选择,但内部有两个地址映射区域,它们具有独立的保护扇区和控制/状态寄存器。也许会有两个“Reg”声明来解释这两组控制寄存器,一个字节偏移量为0x8800。 以上来自于百度翻译 以下为原文 Hi, I am looking for the Linux patch to support the S70GL02GS Flash. According to this KB article (S70GL02GS Support Under Linux - KBA218976 ), you have to create a Support Case to receive the patch. I have done so, but I have only received automated replies so far. I am also interested in how to specify the S70GL02GS in the Device Tree Source (.dts) file that Linux parses when it is loaded. For a typical CFI-compatible 2Mbit, 128Mx16 NOR Flash, I would expect its entry to look something like this: norflash@0,0 { #address-cells = <0x1>; #size-cells = <0x1>; compatible = "cfi-flash"; reg = <0x0 0x0 0x10000000>; bank-width = <0x2>; device-width = <0x1>; But the S70GL02GS is actually two 1Mbit NOR Flash die (S29GL01GS) in the same package. So there is one external chip select, but internally there are two address-mapped regions that have independent protected sectors and control/status registers. Perhaps there would be two "reg" declarations to account for the two sets of control registers, one at byte offset 0x8000000? |
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你好,迈克,
感谢您联系柏树社区论坛。我们目前正在审查你的请求,一旦找到解决方案,我们会尽快回复你。 谢谢你 当做, 布沙拉 以上来自于百度翻译 以下为原文 Hello Mike, Thank you for contacting Cypress Community Forum. We are currently reviewing you request and will get back to you as soon as we find the resolution. Thank you Regards, Bushra |
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你好,迈克, 请在下面找到一个链接到请求的修补程序: http://cCyrp MySharePoint?com::U//GON/BACDYCyPress?COM/ED3Q4OLYJ8VI9DJYLB-VQUB5M20MLGY3HDH9MRUS 7OHFG?E= NGLJBZ 这是一个双骰子堆栈设备,所以你的评论是绝对正确的。您应该在设备树中有两个单独的条目,每个死亡一个。 最好的问候, 巴塞姆 ---- 巴金达西 赛普拉斯半导体公司 客户应用工程 以上来自于百度翻译 以下为原文 Hello Mike, Please find below a link to the requested patch: https://cycorp-my.sharepoint.com/:u:/g/personal/bacd_cypress_com/Ed3Q4oL_J8VIl9Dj_LB-VQUB5m20mLGY3hdh9mRUs7ohFg?e=nGl***Z This is a dual die stack device so your comment is absolutely correct. You should have two separate entries in your device tree, one per die. Best regards, Bacem ---- Bacem Daassi Cypress Semiconductor Corp. Customer Application Engineering |
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ueutriwu 发表于 2018-9-10 20:31 我很好奇为什么你会期望在这个Flash的设备树源文件中看到两个条目。 Linux修补程序似乎修改了S70GL02GS所报告的设备大小。如果查询到的设备是S29 GL01GS闪存,则它不会产生任何影响。如果在.DTS文件中创建两个不同的条目,表示单个S29 GL001GS的死亡,则似乎查询的设备大小将太大。随着补丁和两个条目在.DTS中,S70GL02GS大小将被报告两次。 在嵌入式Linux .DTS文件中,是否有S70GL02GS指定为CFI兼容设备的示例?如果这个Linux补丁存在,它肯定已经在某个地方使用过。如果不是,你是否有一个在.dts文件中连续地址的S29 GL01GS闪存的例子来模拟S70GL02GS? 以上来自于百度翻译 以下为原文 I am curious as to why you would expect to see two entries in the Device Tree Source file for this flash. The Linux patch appears to modify the reported device size for the S70GL02GS. It does not appear to have any effect if the device queried is a S29GL01GS Flash. If I create two distinct entries in the .dts file, representing individual S29GL01GS dies, it seems like the queried device size will be too large. With the patch and two entries in the .dts, the S70GL02GS size will be reported twice. Do you have any examples of the S70GL02GS specified as a cfi-compatible device in an embedded Linux .dts file? If this Linux patch exists, it must have been used somewhere. If not, do you have an example of S29GL01GS Flashes at consecutive addresses in a .dts file to model the S70GL02GS? |
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szj0213 发表于 2018-9-10 20:44 你好,迈克, 在处理双模具S70GL02GS器件时,必须特别注意。其原因是命令必须分别对每个芯片进行处理(特别是解锁命令:0x55 5/0xAA&AMP;0x2AA/0x55),否则命令可能无法工作。 这就是为什么这个芯片需要被视为两个单独的设备,虽然它们坐在同一CS下。 因此,应该在两个步骤中对设备进行探测,这就是为什么在设备树中需要两个设备条目。 这两个设备将位于两个连续映射的地址中,并且您必须在这两个映射的地址上运行探测功能,每个地址都是1GB。 然后,您可以选择使用MTD CONTAT特性来连接两个MTD设备,使它们看起来像一个。 不幸的是,我没有任何基于Linux的例子。 我希望现在已经足够清楚了。谢谢! 最好的问候, 巴塞姆 ---- 巴金达西 赛普拉斯半导体公司 客户应用工程 以上来自于百度翻译 以下为原文 Hello Mike, A special attention must be given when handling the dual-die S70GL02GS device. The reason for this is that the commands must be addressed to every die separately (specially the unlock commands: 0x555/0xaa & 0x2AA/0x55) otherwise the commands may not work. That's why this chip needs to be treated as two separate devices although they're sitting under the same CS#. So probing the device should be done in two steps, that's why the need for two device entries in the device tree. These two devices will be located in two consecutive mapped addresses and you will have to run your probing function on these two mapped addresses, of 1Gb each. You can then chose to use the mtd-concat feature to concatenate your two mtd devices and make them look like one. Unfortunately, I don't have any linux based example for this chip. I hope it's clear enough now. Thanks! Best regards, Bacem ---- Bacem Daassi Cypress Semiconductor Corp. Customer Application Engineering |
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