[size=12.6316px]一、芯片特点
[size=12.6316px]待机功耗小于60mW@220Vac
[size=12.6316px]内置优化的OCP补偿
[size=12.6316px]自适应多模式工作,根据负载情况,自动切换到Burst模式、PFM模式或PWM模式
[size=12.6316px]内置前沿消隐电路(LEB)
[size=12.6316px]内置斜率补偿电路
[size=12.6316px]逐周期峰值电流限制
[size=12.6316px]开机软启动
[size=12.6316px]具有过流保护、过载保护、VDD过压保护等多种保护
[size=12.6316px]二、典型应用
[size=12.6316px]2.1 实物图
[size=12.6316px]2.2 待机功耗与效率测试
[size=12.6316px]2.3 Start-up波形图
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115Vac满载
TST_DELAY=1.56S
[size=12.6316px]2.4 开关波形图
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Vin=264Vac满载
[size=12.6316px]CH1:Vka=80V;CH2:Vds=552V
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2.5 电磁干扰测试
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传导波形
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辐射波形
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